LFXP15C-4F256C

The LFXP15C-4F256C is a non-volatile, reconfigurable FPGA device in a 256-ball fpBGA (17 × 17 mm) package. It integrates approximately 15,000 logic elements, roughly 0.33 Mbits of on-chip RAM, and up to 188 I/Os to address mid-density logic and embedded memory needs for commercial designs.

Built on the LatticeXP family architecture, the device provides instant-on capability without external configuration memory, flexible multi‑standard I/O, and in-field reconfiguration options—features that support rapid system startup, secure configuration, and in-system updates.

Key Features

• Core Logic — Approximately 15,000 logic elements and 1932 PFU/PFF logic resource units deliver mid-range logic capacity for complex glue logic, control and data-path functions.
• Embedded Memory — Total on-chip RAM of 331,776 bits (approximately 0.33 Mbits) for distributed and block memory use within designs.
• I/O Flexibility — 188 user I/Os available in the 256-ball fpBGA package with a programmable sysIO™ buffer supporting multiple standards including LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS as documented for the LatticeXP family.
• Non‑volatile, Instant‑On — Internal non‑volatile configuration enables instant-on power-up and eliminates the need for external configuration memory, improving system simplicity and security.
• In‑System Reconfiguration — Supports TransFR™ reconfiguration for in-field logic updates and rapid SRAM-based reprogramming via system configuration and JTAG ports.
• Power and Voltage Support — Device supply range 1.71 V to 3.465 V; LatticeXP family operation supports common core/I/O rails listed in the datasheet (1.2/1.8/2.5/3.3 V).
• Low‑Power Modes — Sleep mode can reduce static current by up to 1000× compared to active standby as specified for the LatticeXP family.
• Clocking and Memory Interfaces — Up to 4 analog PLLs per device and dedicated DDR memory support (family-level capability) enable a variety of timing and memory interface topologies.
• Package and Mounting — 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package for compact board-level integration. RoHS‑compliant.
• Commercial Grade Temperature — Rated for 0 °C to 85 °C operation suitable for commercial applications.

Typical Applications

• Embedded Control and Glue Logic — Use the device for control planes, protocol conversion and glue logic where mid-density logic and flexible I/O are required.
• High‑Speed Interface Bridging — Flexible sysIO buffers and PLLs support interfacing between mixed-voltage domains and a variety of serial/parallel signaling standards.
• In‑Field Upgradable Systems — Non-volatile configuration with TransFR reconfiguration enables field updates and system-level logic refresh without external configuration memory.

Unique Advantages

• Instant‑on Configuration: Non‑volatile architecture eliminates external configuration memory and enables microsecond power-up for fast system availability.
• Secure, Integrated Configuration: No external bitstream storage reduces attack surface and simplifies board-level BOM and layout.
• Flexible I/O and Memory Support: Wide range of supported I/O standards and embedded RAM allow mixed-signal interfacing and local buffering without added components.
• In‑Field Reconfiguration: TransFR and JTAG/system configuration ports enable in-system updates and rapid SRAM reprogramming for iterative development and upgrades.
• Power Management Options: Sleep mode capable of large static current reduction helps lower standby power in battery‑sensitive applications.
• Compact, Assembly‑Friendly Package: 256‑ball fpBGA (17 × 17 mm) gives a balance of I/O count and board area for compact commercial designs.

Why Choose LFXP15C-4F256C?

The LFXP15C-4F256C brings LatticeXP family capabilities—non‑volatile instant-on configuration, flexible multi‑standard I/O, embedded memory, PLLs and in-field reconfiguration—into a compact 256‑ball fpBGA device sized for mid-density system designs. Its combination of approximately 15,000 logic elements, ~0.33 Mbits of on-chip RAM and 188 I/Os makes it well suited to commercial embedded systems that require secure configuration, mixed-voltage interfacing and in-field updateability.

With a commercial temperature rating and RoHS compliance, this device is positioned for applications that demand reliable, integrated FPGA functionality without external configuration memory, while providing designers access to the LatticeXP family feature set for scalable system development.

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