LFXP15C-3FN388I

The LFXP15C-3FN388I is a non-volatile LatticeXP family FPGA offering 15,000 logic elements, 268 I/Os and embedded memory resources. Built on the ispXP technology, this device provides instant-on operation without external configuration memory and supports in-field reconfiguration and low-power operation.

Targeted for industrial-grade system designs, the device combines flexible I/O standards, dedicated DDR memory support and on-chip PLLs to address applications that require high I/O density, embedded RAM and deterministic boot behavior under a wide operating temperature and supply range.

Key Features

• Core Capacity  15,000 logic elements with 1,932 PFU/PFF logic blocks (device family count shown in datasheet).
• Embedded Memory  Approximately 0.332 Mbits (331,776 bits) of on-chip RAM with a combination of block and distributed memory resources.
• I/O Density & Flexibility  268 I/Os in a 388-ball fpBGA (23 × 23 mm) package with programmable sysIO buffer supporting LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS interface standards as listed in the family datasheet.
• Non‑volatile Instant‑On  ispXP non-volatile architecture delivers instant-on operation without external configuration memory and protects design bitstreams from readback.
• In-field Reconfiguration  TransFR™ reconfiguration enables logic updates while the system remains operational, and designs can be reprogrammed through system configuration and JTAG ports.
• Dedicated Memory Interface  Supports dedicated DDR memory interfaces up to DDR333 (166 MHz) as described in the family datasheet.
• Clocking  Up to four analog PLLs for clock multiply, divide and phase shifting functions.
• Low Power & Sleep Mode  Sleep mode available for up to a 1000× reduction in static current for power-sensitive systems.
• Industrial Grade & Operating Range  Industrial grade device with operating temperature from −40 °C to 100 °C and supply voltage range of 1.71 V to 3.465 V.
• Package  388-ball FPBGA (23 × 23 mm) supplier device package, surface-mount mounting type.

Typical Applications

• Industrial Control & Automation  High I/O density and industrial temperature rating make this device suitable for control logic, sensor aggregation and real-time I/O processing in industrial systems.
• Communications & Networking  Programmable I/O standards, LVDS support and DDR interface capability support protocol bridging, packet processing and interface adaptation.
• Embedded Systems & Instrumentation  On-chip memory, multiple PLLs and instant-on capability enable compact embedded platforms and instrumentation designs that require fast, deterministic startup.

Unique Advantages

• Integrated Non‑Volatile FPGA:  Instant-on operation without external configuration memory reduces BOM and simplifies board design.
• High Logic and Memory Integration:  15,000 logic elements and approximately 0.332 Mbits of embedded RAM allow complex designs with reduced external components.
• Flexible I/O and Interface Support:  Extensive programmable I/O standards enable broad interface compatibility without additional level-shifting hardware.
• In‑Field Upgradability:  TransFR reconfiguration enables field updates to logic while the system continues to operate, supporting iterative feature rollout.
• Wide Supply and Temperature Range:  Operation from 1.71 V to 3.465 V and −40 °C to 100 °C supports robust deployment in industrial environments.
• Power Management:  Sleep mode enables substantial reductions in static current for energy-conscious applications.

Why Choose LFXP15C-3FN388I?

The LFXP15C-3FN388I positions itself as a versatile, industrial-grade FPGA that blends non-volatile instant-on behavior with considerable logic density, embedded memory and flexible I/O. Its package density and I/O count address applications that need compact boards with extensive interfacing, while the sleep mode and voltage range offer adaptability across power-sensitive designs.

Backed by the LatticeXP family architecture and associated design tool support and IP (as described in the datasheet), this device is suited to engineers seeking a reconfigurable, field-upgradable solution for industrial and embedded applications requiring deterministic startup and a broad set of interface options.

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