LFXP15C-3FN484I

IC FPGA 300 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA

Quantity 943 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O300Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15C-3FN484I – XP FPGA: 15,000 Logic Elements, 300 I/Os, 484-BBGA

The LFXP15C-3FN484I is a non-volatile LatticeXP family field programmable gate array (FPGA) offering 15,000 logic elements, up to 300 I/Os and approximately 0.33 Mbits of embedded RAM. Designed for industrial-grade systems, the device combines instant-on non-volatile configuration with in-field reconfiguration and flexible high-speed I/O support.

This surface-mount 484-BBGA (23 × 23 mm) package operates across a wide supply range (1.71 V to 3.465 V) and an industrial temperature range (−40 °C to 100 °C), making it suitable for embedded control, high-density I/O interfacing and memory-anchored applications.

Key Features

  • Core Density — 15,000 logic elements with 1,932 internal logic blocks (PFU/PFF total) to implement mid-range FPGA functionality and logic integration.
  • Embedded Memory — Total on-chip RAM of 331,776 bits (approximately 0.33 Mbits) for block and distributed memory requirements within designs.
  • I/O and Interfaces — Up to 300 I/Os in a 484-ball BBGA package; flexible sysIO buffer supports a wide range of interface standards as described in the LatticeXP family data sheet.
  • Non-volatile, Instant-On Architecture — Built-in non-volatile configuration removes the need for external configuration memory and enables fast power-up behavior and secure bitstream handling.
  • In-field Reconfiguration & Sleep Mode — Supports TransFR reconfiguration for incremental field updates and a sleep mode that can reduce static current by up to 1000× as noted in the family data sheet.
  • Clocking — Up to four analog PLLs per device for clock multiplication, division and phase shifting to support complex timing domains.
  • Power and Environmental — Wide operating supply range (1.71 V to 3.465 V) and industrial operating temperature from −40 °C to 100 °C.
  • Package and Mounting — Surface-mount 484-BBGA (23 × 23 mm) supplier package for compact board integration and high I/O density.
  • System-Level Support — Family-level features include IEEE 1149.1 boundary scan and on-chip logic analyzer capabilities for debug and validation (as described in the LatticeXP data sheet).

Typical Applications

  • Industrial Control & Automation — Implement motor control, protocol bridging and deterministic I/O handling using the device's industrial temperature rating and flexible I/O support.
  • Communications & Networking — Support memory interfaces and high-density I/O requirements, including dedicated DDR memory interface capability noted for the LatticeXP family.
  • Embedded System Integration — Use on-chip RAM and PLL resources to consolidate glue logic, timing alignment and local data buffering in embedded controllers and appliances.
  • Test & Measurement — Leverage instant-on configuration and on-chip debug features for instrumentation, signal processing and data acquisition front-ends.

Unique Advantages

  • Non-volatile Instant-On Configuration: Eliminates the need for external configuration memory and enables immediate start-up behavior.
  • Field Reconfiguration: TransFR reconfiguration capability allows in-system logic updates without full system downtime.
  • High I/O Density in Compact Package: 300 I/Os in a 484-BBGA (23 × 23 mm) package helps reduce board area while supporting dense interfacing.
  • Industrial Temperature Range: Rated for −40 °C to 100 °C to meet demanding environmental conditions.
  • Flexible Power Supply Range: Operates across 1.71 V to 3.465 V to accommodate diverse system power architectures.
  • Integrated Memory Resources: Approximately 0.33 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-storage tasks.

Why Choose LFXP15C-3FN484I?

The LFXP15C-3FN484I positions itself as a versatile mid-density FPGA offering a balance of logic capacity, embedded memory and high I/O count in a compact 484-BBGA package. Its non-volatile, instant-on architecture plus support for in-field reconfiguration make it a practical choice for designs that require secure configuration, rapid startup and maintainability over product life.

With a broad operating supply range, industrial temperature rating and family-level support tools and IP as described in the LatticeXP documentation, this device is well suited to engineers building robust embedded systems, communications interfaces and industrial automation equipment that benefit from on-chip resources and reconfigurable logic.

Request a quote or submit a product inquiry to obtain pricing and availability for the LFXP15C-3FN484I. Provide your requirements and quantities to receive a tailored response.

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