LFXP15C-4F484C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA |
|---|---|
| Quantity | 603 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 300 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1932 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 331776 |
Overview of LFXP15C-4F484C – XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA
The LFXP15C-4F484C is a non-volatile LatticeXP family FPGA offering 15,000 logic elements, approximately 0.33 Mbits of embedded RAM, and up to 300 I/Os in a 484-ball BBGA package. It combines reconfigurable logic, embedded memory and flexible I/O to support system-level functions where instant-on configuration, in-field updates and a high I/O count are required.
Designed for commercial-grade applications, this surface-mount device supports a broad supply voltage range and on-chip system features that simplify integration of custom interfaces and memory subsystems.
Key Features
- Non-volatile, reconfigurable architecture – Instant-on operation with no external configuration memory required and design security through an internal, non-exportable configuration.
- Logic capacity – 15,000 logic elements suitable for mid-density custom logic and system glue logic implementations.
- Embedded memory – Approximately 0.33 Mbits of on-chip RAM for block and distributed memory requirements.
- High I/O count – 300 I/Os available in the 484-BBGA (23 × 23 mm) package to support dense interface requirements.
- Flexible I/O standards – Programmable I/O buffers support a wide range of interfaces noted in the LatticeXP family, enabling connectivity across multiple signaling standards.
- Clocking and timing – Up to four analog PLLs per device for clock multiplication, division and phase shifting to support diverse clocking schemes.
- In-field reconfiguration – TransFR™ reconfiguration capability for updating SRAM-based logic while the system operates; reconfiguration of SRAM logic in milliseconds.
- Low-power modes – Sleep mode enables significant static current reduction for power-sensitive designs.
- Supply and mounting – Operates across 1.71 V to 3.465 V supply range and available in a 484-FPBGA (23 × 23 mm) surface-mount package.
- Commercial temperature grade – Rated for 0 °C to 85 °C operating temperature for commercial applications.
- RoHS compliant – Meets lead-free and RoHS environmental requirements.
Typical Applications
- Interface bridging and protocol conversion – High I/O count and flexible I/O support make it well suited for aggregating or translating multiple interfaces in communication and networking modules.
- Memory controller and buffering – Embedded RAM and dedicated DDR support in the LatticeXP family enable memory interface and buffering functions for mid-range systems.
- Embedded system glue logic – 15,000 logic elements provide capacity for custom control logic, glue logic and peripheral aggregation in embedded consumer and commercial products.
Unique Advantages
- Instant-on, non-volatile configuration: Eliminates the need for external configuration memory and enables microsecond-class power-up for rapid system readiness.
- In-field updates without downtime: TransFR reconfiguration allows SRAM logic updates while the system is running, supporting iterative development and field upgrades.
- Comprehensive I/O flexibility: Programmable sysIO buffers and a 300-pin I/O count simplify mixed-signal and multi-standard interface designs, reducing additional interface components.
- Integrated timing resources: Multiple PLLs on-chip reduce the need for external clock conditioning and simplify complex clock domain management.
- Compact, high-density package: 484-ball FPBGA (23 × 23 mm) provides a small footprint for designs requiring many I/Os and moderate logic capacity.
Why Choose LFXP15C-4F484C?
The LFXP15C-4F484C positions itself as a versatile mid-density FPGA solution for commercial embedded designs that need a balance of logic capacity, embedded memory and extensive I/O. Its non-volatile architecture, instant-on behavior and in-field reconfiguration capability provide design flexibility and reduce system-level BOM by removing external configuration memory.
With programmable I/O, multiple PLLs and a broad supply voltage window, this device is suited to system designers seeking a reconfigurable core for interface consolidation, custom controllers and memory interfacing in commercial applications. RoHS compliance and surface-mount packaging support modern manufacturing flows.
Request a quote or submit an inquiry to learn more about pricing, availability and integration support for the LFXP15C-4F484C. Our team can provide additional technical details and ordering information to help you evaluate this FPGA for your design.

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