LFXP15C-4F484C

IC FPGA 300 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA

Quantity 603 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O300Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15C-4F484C – XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA

The LFXP15C-4F484C is a non-volatile LatticeXP family FPGA offering 15,000 logic elements, approximately 0.33 Mbits of embedded RAM, and up to 300 I/Os in a 484-ball BBGA package. It combines reconfigurable logic, embedded memory and flexible I/O to support system-level functions where instant-on configuration, in-field updates and a high I/O count are required.

Designed for commercial-grade applications, this surface-mount device supports a broad supply voltage range and on-chip system features that simplify integration of custom interfaces and memory subsystems.

Key Features

  • Non-volatile, reconfigurable architecture – Instant-on operation with no external configuration memory required and design security through an internal, non-exportable configuration.
  • Logic capacity – 15,000 logic elements suitable for mid-density custom logic and system glue logic implementations.
  • Embedded memory – Approximately 0.33 Mbits of on-chip RAM for block and distributed memory requirements.
  • High I/O count – 300 I/Os available in the 484-BBGA (23 × 23 mm) package to support dense interface requirements.
  • Flexible I/O standards – Programmable I/O buffers support a wide range of interfaces noted in the LatticeXP family, enabling connectivity across multiple signaling standards.
  • Clocking and timing – Up to four analog PLLs per device for clock multiplication, division and phase shifting to support diverse clocking schemes.
  • In-field reconfiguration – TransFR™ reconfiguration capability for updating SRAM-based logic while the system operates; reconfiguration of SRAM logic in milliseconds.
  • Low-power modes – Sleep mode enables significant static current reduction for power-sensitive designs.
  • Supply and mounting – Operates across 1.71 V to 3.465 V supply range and available in a 484-FPBGA (23 × 23 mm) surface-mount package.
  • Commercial temperature grade – Rated for 0 °C to 85 °C operating temperature for commercial applications.
  • RoHS compliant – Meets lead-free and RoHS environmental requirements.

Typical Applications

  • Interface bridging and protocol conversion – High I/O count and flexible I/O support make it well suited for aggregating or translating multiple interfaces in communication and networking modules.
  • Memory controller and buffering – Embedded RAM and dedicated DDR support in the LatticeXP family enable memory interface and buffering functions for mid-range systems.
  • Embedded system glue logic – 15,000 logic elements provide capacity for custom control logic, glue logic and peripheral aggregation in embedded consumer and commercial products.

Unique Advantages

  • Instant-on, non-volatile configuration: Eliminates the need for external configuration memory and enables microsecond-class power-up for rapid system readiness.
  • In-field updates without downtime: TransFR reconfiguration allows SRAM logic updates while the system is running, supporting iterative development and field upgrades.
  • Comprehensive I/O flexibility: Programmable sysIO buffers and a 300-pin I/O count simplify mixed-signal and multi-standard interface designs, reducing additional interface components.
  • Integrated timing resources: Multiple PLLs on-chip reduce the need for external clock conditioning and simplify complex clock domain management.
  • Compact, high-density package: 484-ball FPBGA (23 × 23 mm) provides a small footprint for designs requiring many I/Os and moderate logic capacity.

Why Choose LFXP15C-4F484C?

The LFXP15C-4F484C positions itself as a versatile mid-density FPGA solution for commercial embedded designs that need a balance of logic capacity, embedded memory and extensive I/O. Its non-volatile architecture, instant-on behavior and in-field reconfiguration capability provide design flexibility and reduce system-level BOM by removing external configuration memory.

With programmable I/O, multiple PLLs and a broad supply voltage window, this device is suited to system designers seeking a reconfigurable core for interface consolidation, custom controllers and memory interfacing in commercial applications. RoHS compliance and surface-mount packaging support modern manufacturing flows.

Request a quote or submit an inquiry to learn more about pricing, availability and integration support for the LFXP15C-4F484C. Our team can provide additional technical details and ordering information to help you evaluate this FPGA for your design.

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