LFXP15C-4FN388C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 268 331776 15000 388-BBGA |
|---|---|
| Quantity | 956 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 388-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 388-BBGA | Number of I/O | 268 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1932 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 331776 |
Overview of LFXP15C-4FN388C – XP Field Programmable Gate Array (FPGA) IC 268 331776 15000 388-BBGA
The LFXP15C-4FN388C is a non-volatile, reconfigurable FPGA from the LatticeXP family, offering a balance of logic capacity, on-chip memory and flexible I/O in a compact 388-ball BGA package. Designed for commercial-grade embedded and system applications, it provides instant-on capability, in-field reconfiguration and a broad voltage operating range to support multi-voltage designs.
Key device metrics include 15,000 logic elements, 331,776 total RAM bits (approximately 0.33 Mbits) and 268 I/Os in a 388-FPBGA (23 × 23 mm) surface-mount package. The device is RoHS compliant and rated for 0 °C to 85 °C operation.
Key Features
- Non-volatile, instant-on architecture The LatticeXP family technology provides non-volatile configuration with rapid power-up and no requirement for external configuration memory.
- In-field reconfiguration Supports TransFR™ reconfiguration for updating logic while the system is operating and reconfiguring SRAM-based logic in milliseconds.
- Logic capacity Approximately 15,000 logic elements for mid-range integration of combinational and sequential logic.
- Embedded and distributed memory 331,776 total RAM bits of on-chip memory (approximately 0.33 Mbits) plus distributed RAM options for flexible data buffering and state storage.
- Flexible I/O and signaling Up to 268 I/Os with programmable sysIO™ buffer options across common voltage standards to support a wide range of interfaces.
- Dedicated DDR memory support Implements interfaces up to DDR333, enabling external memory connectivity for bandwidth-demanding applications.
- Clock management Up to four analog PLLs per device for clock multiply, divide and phase shifting functions.
- System-level debug and configuration IEEE 1149.1 boundary scan, ispTRACY™ internal logic analysis capability and an onboard oscillator for configuration.
- Package and mounting 388-ball fpBGA (23 × 23 mm) package, surface-mount mounting type for compact board-level integration.
- Power and temperature Voltage supply range 1.71 V to 3.465 V and commercial operating temperature range 0 °C to 85 °C.
- Regulatory RoHS compliant.
Typical Applications
- Embedded controllers and system glue logic Use the device to implement custom control logic, protocol bridging and application-specific state machines where non-volatile, instant-on behavior is beneficial.
- Memory interface and buffering Ideal for designs requiring DDR333-class memory interfaces and on-chip RAM for buffering and temporary storage.
- High-density I/O systems Applications that need many programmable I/Os—up to 268—such as interface aggregation, sensor hubs and industrial communication modules.
- Field-updatable logic Systems that require in-field updates and rapid reconfiguration for feature upgrades or bug fixes without external configuration memory.
Unique Advantages
- Non-volatile configuration: Eliminates the need for external configuration memory and enables instant-on operation.
- In-field reconfiguration capability: TransFR™ enables updating logic while the system remains operational, reducing maintenance downtime.
- Balanced integration: 15,000 logic elements combined with approximately 0.33 Mbits of embedded memory provide a mid-range integration point for many system designs.
- Flexible interfaces: Programmable I/O buffers and dedicated DDR support simplify interfacing to a variety of external devices and memory.
- Compact BGA package: 388-ball fpBGA (23 × 23 mm) provides a high-pin-count solution in a compact footprint for space-constrained boards.
- Design ecosystem support: Family-level support includes ispLEVER design tools and available IP cores to accelerate development.
Why Choose LFXP15C-4FN388C?
The LFXP15C-4FN388C is positioned for designers who need a commercial-grade, non-volatile FPGA with solid logic capacity, meaningful on-chip memory and extensive I/O in a compact package. Its instant-on behavior and in-field reconfiguration capabilities make it suitable for systems that require rapid startup and field updates without external configuration storage.
With a wide voltage supply range, up to four PLLs, dedicated DDR support and family-level design tool and IP support, this device delivers a balanced combination of performance, integration and flexibility for embedded systems, interface logic and mid-density FPGA roles.
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