LFXP15C-4FN388C

IC FPGA 268 I/O 388FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 268 331776 15000 388-BBGA

Quantity 956 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package388-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case388-BBGANumber of I/O268Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15C-4FN388C – XP Field Programmable Gate Array (FPGA) IC 268 331776 15000 388-BBGA

The LFXP15C-4FN388C is a non-volatile, reconfigurable FPGA from the LatticeXP family, offering a balance of logic capacity, on-chip memory and flexible I/O in a compact 388-ball BGA package. Designed for commercial-grade embedded and system applications, it provides instant-on capability, in-field reconfiguration and a broad voltage operating range to support multi-voltage designs.

Key device metrics include 15,000 logic elements, 331,776 total RAM bits (approximately 0.33 Mbits) and 268 I/Os in a 388-FPBGA (23 × 23 mm) surface-mount package. The device is RoHS compliant and rated for 0 °C to 85 °C operation.

Key Features

  • Non-volatile, instant-on architecture The LatticeXP family technology provides non-volatile configuration with rapid power-up and no requirement for external configuration memory.
  • In-field reconfiguration Supports TransFR™ reconfiguration for updating logic while the system is operating and reconfiguring SRAM-based logic in milliseconds.
  • Logic capacity Approximately 15,000 logic elements for mid-range integration of combinational and sequential logic.
  • Embedded and distributed memory 331,776 total RAM bits of on-chip memory (approximately 0.33 Mbits) plus distributed RAM options for flexible data buffering and state storage.
  • Flexible I/O and signaling Up to 268 I/Os with programmable sysIO™ buffer options across common voltage standards to support a wide range of interfaces.
  • Dedicated DDR memory support Implements interfaces up to DDR333, enabling external memory connectivity for bandwidth-demanding applications.
  • Clock management Up to four analog PLLs per device for clock multiply, divide and phase shifting functions.
  • System-level debug and configuration IEEE 1149.1 boundary scan, ispTRACY™ internal logic analysis capability and an onboard oscillator for configuration.
  • Package and mounting 388-ball fpBGA (23 × 23 mm) package, surface-mount mounting type for compact board-level integration.
  • Power and temperature Voltage supply range 1.71 V to 3.465 V and commercial operating temperature range 0 °C to 85 °C.
  • Regulatory RoHS compliant.

Typical Applications

  • Embedded controllers and system glue logic Use the device to implement custom control logic, protocol bridging and application-specific state machines where non-volatile, instant-on behavior is beneficial.
  • Memory interface and buffering Ideal for designs requiring DDR333-class memory interfaces and on-chip RAM for buffering and temporary storage.
  • High-density I/O systems Applications that need many programmable I/Os—up to 268—such as interface aggregation, sensor hubs and industrial communication modules.
  • Field-updatable logic Systems that require in-field updates and rapid reconfiguration for feature upgrades or bug fixes without external configuration memory.

Unique Advantages

  • Non-volatile configuration: Eliminates the need for external configuration memory and enables instant-on operation.
  • In-field reconfiguration capability: TransFR™ enables updating logic while the system remains operational, reducing maintenance downtime.
  • Balanced integration: 15,000 logic elements combined with approximately 0.33 Mbits of embedded memory provide a mid-range integration point for many system designs.
  • Flexible interfaces: Programmable I/O buffers and dedicated DDR support simplify interfacing to a variety of external devices and memory.
  • Compact BGA package: 388-ball fpBGA (23 × 23 mm) provides a high-pin-count solution in a compact footprint for space-constrained boards.
  • Design ecosystem support: Family-level support includes ispLEVER design tools and available IP cores to accelerate development.

Why Choose LFXP15C-4FN388C?

The LFXP15C-4FN388C is positioned for designers who need a commercial-grade, non-volatile FPGA with solid logic capacity, meaningful on-chip memory and extensive I/O in a compact package. Its instant-on behavior and in-field reconfiguration capabilities make it suitable for systems that require rapid startup and field updates without external configuration storage.

With a wide voltage supply range, up to four PLLs, dedicated DDR support and family-level design tool and IP support, this device delivers a balanced combination of performance, integration and flexibility for embedded systems, interface logic and mid-density FPGA roles.

Request a quote or submit an inquiry to receive pricing and availability information for the LFXP15C-4FN388C.

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