LFXP15C-4FN484I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA |
|---|---|
| Quantity | 576 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 300 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1932 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 331776 |
Overview of LFXP15C-4FN484I – XP FPGA IC, 15,000 Logic Elements, 484‑BBGA
The LFXP15C-4FN484I is a Lattice Semiconductor Corporation FPGA in the LatticeXP family that combines non-volatile, reconfigurable logic with substantial on-chip memory and high I/O density. With 15,000 logic elements, approximately 0.332 Mbits of embedded RAM, and up to 300 I/Os in a 484‑ball BGA, this device targets embedded and industrial designs that require instant-on behavior, flexible I/O signaling, and in-field reconfiguration.
Designed for surface-mount assembly and industrial operating conditions, the LFXP15C-4FN484I supports a wide supply voltage range and clocking resources suitable for systems requiring deterministic timing and memory interfaces.
Key Features
- Core Architecture — Non‑volatile, Reconfigurable Instant-on, non-volatile ispXP™ technology with the ability to reconfigure SRAM-based logic in milliseconds and to program both SRAM and non‑volatile memory through system configuration and JTAG ports.
- Logic Capacity 15,000 logic elements for mid-range integration and complex logic functions.
- Embedded Memory Approximately 0.332 Mbits of on-chip RAM (331,776 bits) for distributed and block memory requirements.
- I/O and Interface Flexibility Up to 300 I/Os in the 484‑BBGA package with programmable sysIO™ buffers supporting LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS signaling options.
- Dedicated DDR Support Implements interfaces up to DDR333 (166 MHz) for connecting external DDR memory devices.
- Clocking Up to four analog PLLs for clock multiply/divide and phase shifting to support complex timing domains.
- Power Management & Security Sleep mode for substantial static current reduction and design security features that avoid external configuration bitstream exposure.
- Package, Mounting & Grade 484‑ball fpBGA (23×23 mm) surface-mount package; industrial grade with an operating temperature range of −40°C to 100°C.
- Supply Voltage Range Operates across a 1.71 V to 3.465 V supply range to support multi-voltage system designs.
Typical Applications
- Embedded and Communications Systems Use the flexible I/O standards, high I/O count and DDR interface capability to implement protocol bridging, data-path logic and memory interfaces.
- Industrial Control and Automation Industrial-grade temperature range and extensive I/O allow implementation of control logic and system interfacing in factory and process environments.
- Field‑Updatable Systems Non‑volatile instant-on operation plus TransFR reconfiguration enable in-field updates and runtime logic changes with minimal disruption to system operation.
Unique Advantages
- Instant‑on, non‑volatile operation: Eliminates the need for external configuration memory and provides secure, fast startup.
- High integration density: 15,000 logic elements with embedded block and distributed RAM reduce external component count.
- Rich I/O and signaling support: 300 I/Os with programmable sysIO buffers cover a broad set of interface standards for system-level flexibility.
- Industrial robustness: Surface-mount 484‑BBGA packaging and −40°C to 100°C operating range meet industrial environment requirements.
- In-field reconfiguration and low-power modes: TransFR reconfiguration and sleep mode provide adaptability and static current reduction.
Why Choose LFXP15C-4FN484I?
The LFXP15C-4FN484I positions itself as a mid-density, industrial-grade FPGA that balances logic capacity, embedded memory and a high I/O count in a compact 484‑ball BGA. Its non‑volatile architecture and instant-on capability simplify system design by removing external configuration memory and enhancing security.
Engineers building embedded systems, industrial controllers, or communications interfaces will benefit from the device’s flexible I/O standards, dedicated DDR support, multiple PLLs and in-field reconfiguration features—delivering a scalable, maintainable building block for long-term product deployment.
Request a quote or submit an inquiry to receive pricing, availability and technical procurement details for the LFXP15C-4FN484I.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016