LFXP15C-4FN484I

IC FPGA 300 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA

Quantity 576 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O300Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15C-4FN484I – XP FPGA IC, 15,000 Logic Elements, 484‑BBGA

The LFXP15C-4FN484I is a Lattice Semiconductor Corporation FPGA in the LatticeXP family that combines non-volatile, reconfigurable logic with substantial on-chip memory and high I/O density. With 15,000 logic elements, approximately 0.332 Mbits of embedded RAM, and up to 300 I/Os in a 484‑ball BGA, this device targets embedded and industrial designs that require instant-on behavior, flexible I/O signaling, and in-field reconfiguration.

Designed for surface-mount assembly and industrial operating conditions, the LFXP15C-4FN484I supports a wide supply voltage range and clocking resources suitable for systems requiring deterministic timing and memory interfaces.

Key Features

  • Core Architecture — Non‑volatile, Reconfigurable Instant-on, non-volatile ispXP™ technology with the ability to reconfigure SRAM-based logic in milliseconds and to program both SRAM and non‑volatile memory through system configuration and JTAG ports.
  • Logic Capacity 15,000 logic elements for mid-range integration and complex logic functions.
  • Embedded Memory Approximately 0.332 Mbits of on-chip RAM (331,776 bits) for distributed and block memory requirements.
  • I/O and Interface Flexibility Up to 300 I/Os in the 484‑BBGA package with programmable sysIO™ buffers supporting LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS signaling options.
  • Dedicated DDR Support Implements interfaces up to DDR333 (166 MHz) for connecting external DDR memory devices.
  • Clocking Up to four analog PLLs for clock multiply/divide and phase shifting to support complex timing domains.
  • Power Management & Security Sleep mode for substantial static current reduction and design security features that avoid external configuration bitstream exposure.
  • Package, Mounting & Grade 484‑ball fpBGA (23×23 mm) surface-mount package; industrial grade with an operating temperature range of −40°C to 100°C.
  • Supply Voltage Range Operates across a 1.71 V to 3.465 V supply range to support multi-voltage system designs.

Typical Applications

  • Embedded and Communications Systems Use the flexible I/O standards, high I/O count and DDR interface capability to implement protocol bridging, data-path logic and memory interfaces.
  • Industrial Control and Automation Industrial-grade temperature range and extensive I/O allow implementation of control logic and system interfacing in factory and process environments.
  • Field‑Updatable Systems Non‑volatile instant-on operation plus TransFR reconfiguration enable in-field updates and runtime logic changes with minimal disruption to system operation.

Unique Advantages

  • Instant‑on, non‑volatile operation: Eliminates the need for external configuration memory and provides secure, fast startup.
  • High integration density: 15,000 logic elements with embedded block and distributed RAM reduce external component count.
  • Rich I/O and signaling support: 300 I/Os with programmable sysIO buffers cover a broad set of interface standards for system-level flexibility.
  • Industrial robustness: Surface-mount 484‑BBGA packaging and −40°C to 100°C operating range meet industrial environment requirements.
  • In-field reconfiguration and low-power modes: TransFR reconfiguration and sleep mode provide adaptability and static current reduction.

Why Choose LFXP15C-4FN484I?

The LFXP15C-4FN484I positions itself as a mid-density, industrial-grade FPGA that balances logic capacity, embedded memory and a high I/O count in a compact 484‑ball BGA. Its non‑volatile architecture and instant-on capability simplify system design by removing external configuration memory and enhancing security.

Engineers building embedded systems, industrial controllers, or communications interfaces will benefit from the device’s flexible I/O standards, dedicated DDR support, multiple PLLs and in-field reconfiguration features—delivering a scalable, maintainable building block for long-term product deployment.

Request a quote or submit an inquiry to receive pricing, availability and technical procurement details for the LFXP15C-4FN484I.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1983


    Headquarters: Hillsboro, Oregon, USA


    Employees: 1,000+


    Revenue: $627.7 Million


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up