LFXP15C-4FN484C

IC FPGA 300 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA

Quantity 281 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O300Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15C-4FN484C – XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA

The LFXP15C-4FN484C is a LatticeXP family FPGA offering a non-volatile, reconfigurable logic platform in a 484-ball BGA package. It combines 15,000 logic elements, approximately 0.33 Mbits of on-chip RAM, and up to 300 I/Os to address embedded control, I/O-rich processing and in-field update use cases.

Designed for surface-mount, commercial-grade applications, this device supports a wide supply range (1.71 V to 3.465 V), instant-on non-volatile operation and a 0 °C to 85 °C operating range, enabling compact system designs with flexible I/O and memory resources.

Key Features

  • Non-volatile, instantly configurable architecture — Instant-on operation with no external configuration memory required, providing secure configuration and rapid startup.
  • Reconfigurability and field update — SRAM-based logic can be reconfigured in milliseconds; TransFR™ Reconfiguration enables in-field logic updates while the system operates.
  • Logic and memory resources — 15,000 logic elements and 331,776 total RAM bits (approximately 0.33 Mbits) for mixed logic and embedded memory functions.
  • High-density I/O — Up to 300 I/Os in the 484-ball BBGA package to support complex interfacing and multi-channel designs.
  • Flexible I/O standards — Programmable I/O buffer supports a broad set of interfaces including multiple LVCMOS voltages, LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and RSDS (per LatticeXP family data).
  • Dedicated memory and clock support — Device family implements DDR memory interfaces up to DDR333 and provides up to four analog PLLs for clock multiply/divide and phase shifting.
  • Low-power modes — Sleep mode capability provides substantial static current reduction for power-sensitive applications.
  • Package and mounting — 484-ball FBGA (23 × 23 mm) surface-mount package for high I/O density in compact designs.
  • Compliance and grade — Commercial grade device with RoHS compliance and an operating temperature range of 0 °C to 85 °C.

Typical Applications

  • Embedded system controllers — Implement custom control logic and on-chip memory for appliance, industrial automation and consumer devices within a commercial temperature range.
  • High-density I/O bridging — Aggregate and translate multiple interfaces using up to 300 I/Os and flexible programmable I/O standards.
  • Memory interface logic — Support dedicated DDR interfaces and on-chip block RAM for buffering and memory controller functions.
  • Field-updatable systems — Enable in-field feature upgrades and bug fixes using TransFR™ reconfiguration while systems remain operational.

Unique Advantages

  • Eliminates external configuration memory: Non-volatile architecture removes the need for a separate configuration device, simplifying BOM and startup design.
  • Fast startup and secure configuration: Instant-on behavior reduces system boot time while protecting design bitstreams from external interception.
  • Flexible supply and I/O support: Operates across a wide supply range (1.71 V to 3.465 V) and supports many I/O standards for interface versatility.
  • In-field reconfiguration: TransFR™ and SRAM reprogrammability allow rapid deployment of updates and feature changes without hardware replacement.
  • Integrated clocking and memory resources: Multiple PLLs and embedded RAM provide the on-chip infrastructure needed for timing and buffering tasks.
  • Compact, high-density packaging: The 484-ball FBGA package delivers up to 300 I/Os in a 23 × 23 mm footprint for space-constrained boards.

Why Choose LFXP15C-4FN484C?

The LFXP15C-4FN484C delivers a balanced combination of logic capacity, embedded memory and high I/O count in a non-volatile FPGA tailored for commercial applications. Its instant-on capability and in-field reconfiguration options make it well suited for systems that require rapid startup and lifecycle flexibility.

Engineers building embedded controllers, interface bridges, or memory-interfacing logic will value the device’s on-chip resources, flexible I/O support and compact 484-BBGA packaging. RoHS compliance and a defined operating range provide a clear specification set for procurement and integration into production designs.

Request a quote or submit an inquiry to receive pricing, availability and additional technical details for the LFXP15C-4FN484C.

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