LFXP15C-4FN256C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 331776 15000 256-BGA |
|---|---|
| Quantity | 233 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1932 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 331776 |
Overview of LFXP15C-4FN256C – XP Field Programmable Gate Array (FPGA) IC 188 I/O, 15,000 Logic Elements, 256-BGA
The LFXP15C-4FN256C is a LatticeXP family FPGA delivered in a 256-ball fpBGA (17×17 mm) package. It integrates approximately 15,000 logic elements, abundant programmable I/O and embedded memory to support system-level logic, memory interfacing and configurable I/O functions. Designed for commercial-grade applications, the device targets designs that require non-volatile, instant-on FPGA capability with flexible supply voltages and a broad I/O feature set.
Key Features
- Core Logic Approximately 15,000 logic elements organized across the LatticeXP architecture for implementing combinational and sequential logic.
- Embedded Memory Approximately 0.33 Mbits (331,776 bits / 324 Kbits) of on-chip memory distributed between block and distributed RAM resources for data buffering and state storage.
- I/O and Package 188 user I/Os in a 256-ball fpBGA (256-FPBGA, 17×17 mm) surface-mount package for compact board integration and high pin density.
- Non-volatile, Instant-on Architecture ispXP non-volatile architecture provides immediate configuration at power-up without external configuration memory and supports in-system reconfiguration.
- Voltage and Temperature Flexible supply operation from 1.71 V to 3.465 V; commercial operating temperature range 0 °C to 85 °C.
- Clocking and Timing Up to four analog PLLs per device to enable clock multiplication, division and phase shifting for timing and interface requirements.
- Memory Interface Support Dedicated DDR memory interface capability supporting up to DDR333 (166 MHz) operation for external memory connectivity.
- Programmable I/O Standards sysIO programmable buffers support a wide range of interfaces (LVCMOS levels, LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL, Bus-LVDS, RSDS) to accommodate varied signaling requirements.
- Low-Power Modes Sleep mode support for significant static current reduction during low-activity periods.
- System and Development Support IEEE 1149.1 boundary scan plus on-chip debug and configuration capabilities for system integration and in-field reconfiguration.
- Regulatory RoHS compliant.
Typical Applications
- Memory Interface and Buffering: Use the device's dedicated DDR support and embedded RAM to implement DDR333-compatible interfaces and on-chip data buffering.
- High-Density I/O Control: With 188 I/Os in a compact 256-ball fpBGA, the FPGA is suited for applications requiring many signal lines in constrained board space.
- Configurable Logic for Embedded Systems: Instant-on non-volatile configuration and 15,000 logic elements enable system glue logic, protocol bridging and custom control functions.
- Mixed-Signal Interface Gateways: Programmable sysIO buffers supporting LVDS, PCI and multiple SSTL/HSTL families make the device appropriate for varied interface translation and aggregation tasks.
Unique Advantages
- Instant-On Non-Volatile Operation: Eliminates the need for external configuration memory and enables immediate device availability at power-up.
- Flexible I/O Standards: Programmable I/O buffers support many common signaling families, reducing the need for external level translators.
- Balanced Integration: Combines approximately 15,000 logic elements with roughly 0.33 Mbits of embedded memory and 188 I/Os in a single compact package to minimize BOM and board area.
- Multiple PLLs for Clocking: Up to four analog PLLs provide clock management options for multi-domain systems and high-speed interfaces.
- Power and Thermal Fit for Commercial Designs: Wide supply range (1.71 V–3.465 V) and commercial temperature rating (0 °C–85 °C) for a variety of mainstream applications.
- In-Field Reconfiguration: Reconfigure SRAM-based logic and update designs in-system with TransFR™ reconfiguration and JTAG-accessible configuration pathways.
Why Choose LFXP15C-4FN256C?
The LFXP15C-4FN256C delivers a practical balance of logic capacity, embedded memory and high-density I/O in a compact fpBGA package, backed by the LatticeXP non-volatile FPGA architecture. Its instant-on behavior, multiple PLLs and broad sysIO support make it suitable for systems that require flexible interfacing, memory connectivity and rapid configuration.
This device is well-suited to commercial embedded and communications designs where on-chip memory, configurable I/O standards and the ability to perform in-field updates reduce system complexity and speed time-to-market. RoHS compliance and a broad supply voltage range add to its adaptability in standard commercial product lines.
Request a quote or submit a request for pricing and availability for the LFXP15C-4FN256C to begin configuring this FPGA into your next design.