LFXP15C-4FN256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 331776 15000 256-BGA

Quantity 233 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15C-4FN256C – XP Field Programmable Gate Array (FPGA) IC 188 I/O, 15,000 Logic Elements, 256-BGA

The LFXP15C-4FN256C is a LatticeXP family FPGA delivered in a 256-ball fpBGA (17×17 mm) package. It integrates approximately 15,000 logic elements, abundant programmable I/O and embedded memory to support system-level logic, memory interfacing and configurable I/O functions. Designed for commercial-grade applications, the device targets designs that require non-volatile, instant-on FPGA capability with flexible supply voltages and a broad I/O feature set.

Key Features

  • Core Logic  Approximately 15,000 logic elements organized across the LatticeXP architecture for implementing combinational and sequential logic.
  • Embedded Memory  Approximately 0.33 Mbits (331,776 bits / 324 Kbits) of on-chip memory distributed between block and distributed RAM resources for data buffering and state storage.
  • I/O and Package  188 user I/Os in a 256-ball fpBGA (256-FPBGA, 17×17 mm) surface-mount package for compact board integration and high pin density.
  • Non-volatile, Instant-on Architecture  ispXP non-volatile architecture provides immediate configuration at power-up without external configuration memory and supports in-system reconfiguration.
  • Voltage and Temperature  Flexible supply operation from 1.71 V to 3.465 V; commercial operating temperature range 0 °C to 85 °C.
  • Clocking and Timing  Up to four analog PLLs per device to enable clock multiplication, division and phase shifting for timing and interface requirements.
  • Memory Interface Support  Dedicated DDR memory interface capability supporting up to DDR333 (166 MHz) operation for external memory connectivity.
  • Programmable I/O Standards  sysIO programmable buffers support a wide range of interfaces (LVCMOS levels, LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL, Bus-LVDS, RSDS) to accommodate varied signaling requirements.
  • Low-Power Modes  Sleep mode support for significant static current reduction during low-activity periods.
  • System and Development Support  IEEE 1149.1 boundary scan plus on-chip debug and configuration capabilities for system integration and in-field reconfiguration.
  • Regulatory  RoHS compliant.

Typical Applications

  • Memory Interface and Buffering: Use the device's dedicated DDR support and embedded RAM to implement DDR333-compatible interfaces and on-chip data buffering.
  • High-Density I/O Control: With 188 I/Os in a compact 256-ball fpBGA, the FPGA is suited for applications requiring many signal lines in constrained board space.
  • Configurable Logic for Embedded Systems: Instant-on non-volatile configuration and 15,000 logic elements enable system glue logic, protocol bridging and custom control functions.
  • Mixed-Signal Interface Gateways: Programmable sysIO buffers supporting LVDS, PCI and multiple SSTL/HSTL families make the device appropriate for varied interface translation and aggregation tasks.

Unique Advantages

  • Instant-On Non-Volatile Operation: Eliminates the need for external configuration memory and enables immediate device availability at power-up.
  • Flexible I/O Standards: Programmable I/O buffers support many common signaling families, reducing the need for external level translators.
  • Balanced Integration: Combines approximately 15,000 logic elements with roughly 0.33 Mbits of embedded memory and 188 I/Os in a single compact package to minimize BOM and board area.
  • Multiple PLLs for Clocking: Up to four analog PLLs provide clock management options for multi-domain systems and high-speed interfaces.
  • Power and Thermal Fit for Commercial Designs: Wide supply range (1.71 V–3.465 V) and commercial temperature rating (0 °C–85 °C) for a variety of mainstream applications.
  • In-Field Reconfiguration: Reconfigure SRAM-based logic and update designs in-system with TransFR™ reconfiguration and JTAG-accessible configuration pathways.

Why Choose LFXP15C-4FN256C?

The LFXP15C-4FN256C delivers a practical balance of logic capacity, embedded memory and high-density I/O in a compact fpBGA package, backed by the LatticeXP non-volatile FPGA architecture. Its instant-on behavior, multiple PLLs and broad sysIO support make it suitable for systems that require flexible interfacing, memory connectivity and rapid configuration.

This device is well-suited to commercial embedded and communications designs where on-chip memory, configurable I/O standards and the ability to perform in-field updates reduce system complexity and speed time-to-market. RoHS compliance and a broad supply voltage range add to its adaptability in standard commercial product lines.

Request a quote or submit a request for pricing and availability for the LFXP15C-4FN256C to begin configuring this FPGA into your next design.

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