LFXP15C-3FN484C

The LFXP15C-3FN484C is a non-volatile LatticeXP family FPGA from Lattice Semiconductor designed for system designs that require instant-on behavior, in-field reconfiguration and dense I/O. It integrates approximately 15,000 logic elements with embedded RAM and flexible I/O in a compact 484-ball BGA (23 × 23 mm) package, targeting commercial applications that benefit from on-chip memory, multiple PLLs and a wide supply voltage range.

Key Features

• Core Logic – Approximately 15,000 logic elements for mid-range combinational and sequential logic implementation.
• On-chip Memory – Total on-chip RAM of 331,776 bits (approximately 0.332 Mbits) for embedded block and distributed memory needs.
• I/O Capacity – Up to 300 I/Os in the 484-ball BBGA package to support high-pin-count interfaces and board-level connectivity.
• Non-Volatile, Instant-On Architecture – ispXP non-volatile technology requires no external configuration memory and enables power-up in microseconds.
• In-Field Reconfiguration – Supports TransFR reconfiguration for updating logic while the system operates and reconfiguring SRAM-based logic in milliseconds.
• Flexible I/O Standards – Programmable I/O buffers support a wide range of standards, including LVCMOS (1.2–3.3 V), LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and RSDS.
• Dedicated Memory Interface – Device implements dedicated DDR memory support (up to DDR333) for external memory interfacing.
• Clocking – Up to four analog PLLs for clock multiply/divide and phase shifting.
• Power and Mounting – Operates from 1.71 V to 3.465 V supply range and is supplied in a surface-mount 484-FPBGA (23×23 mm) package.
• Commercial Temperature Grade – Rated for 0 °C to 85 °C operating temperature.
• Regulatory – RoHS compliant.

Typical Applications

• Embedded Systems – Instant-on non-volatile configuration and on-chip memory enable compact embedded control and signal-processing functions without external configuration flash.
• High-Density I/O Bridging – 300 I/Os in a 23×23 mm package allow aggregation and protocol bridging between multiple peripherals and subsystems on space-constrained PCBs.
• Memory Interface and Controllers – Dedicated DDR support and multiple PLLs facilitate implementation of DDR333 interfaces and synchronous memory controllers.
• Field-Upgradeable Logic – TransFR reconfiguration supports in-field logic updates and system feature evolution while the device remains in operation.

Unique Advantages

• Instant-On System Integration: Non-volatile ispXP architecture eliminates external configuration memory and enables microsecond power-up for faster boot and simplified BOM.
• Compact, High-Pin-Count Package: 484-ball BGA (23×23 mm) delivers up to 300 I/Os in a compact footprint for dense designs.
• On-Device Memory Resources: Approximately 0.332 Mbits of embedded RAM reduce dependence on external memory for many control and buffering tasks.
• Flexible I/O and Clocking: Wide programmable I/O standard support plus up to four analog PLLs simplifies interfacing and clock management across mixed-voltage domains.
• Field Reconfiguration: TransFR capability enables in-field updates and rapid logic changes without full system downtime.
• Commercial-Grade Reliability: Designed for 0 °C to 85 °C operation with RoHS compliance for standard commercial applications.

Why Choose LFXP15C-3FN484C?

The LFXP15C-3FN484C positions itself as a versatile mid-density FPGA that balances logic capacity, embedded memory and high I/O count in a compact surface-mount BGA. Its non-volatile instant-on architecture and in-field reconfiguration capabilities offer system designers a way to simplify boot architectures and deploy updates without external configuration devices. The device’s programmable I/O, multiple PLLs and dedicated DDR support make it suitable for mid-range embedded systems, communications bridging, and memory-interface applications that require reliable commercial-grade operation.

Engineers looking for a mid-density FPGA with built-in non-volatile configuration, flexible I/O standards and a compact 23×23 mm package will find the LFXP15C-3FN484C a practical choice for reducing BOM complexity while retaining reprogrammability and on-chip memory resources.

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