LFXP15C-3FN388C

The LFXP15C-3FN388C is a LatticeXP family FPGA designed for systems requiring non-volatile, reconfigurable logic with a high I/O count and on-chip memory. It integrates approximately 15,000 logic elements, roughly 331,776 bits of embedded RAM, and 268 user I/Os in a 388‑ball BGA package, delivering a compact, feature-rich programmable fabric for mid-density embedded designs.

Typical uses include control and interface subsystems, memory and I/O bridging, and on‑board signal processing where instant-on configuration, flexible I/O standards and in-field reconfiguration are advantageous.

Key Features

• Non-volatile, instant-on architecture LatticeXP family technology provides instant-on operation without external configuration memory and supports secure, reconfigurable designs.
• Logic capacity Approximately 15,000 logic elements suitable for mid-density FPGA designs.
• Embedded memory Approximately 0.33 Mbits (331,776 bits) of on-chip RAM combining block and distributed memory for data buffering and state storage.
• High I/O count 268 user I/Os for broad connectivity to peripherals, memories and high-speed interfaces.
• Flexible I/O standards Family‑level support for a wide range of interfaces including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS and others for system-level interoperability.
• Dedicated DDR memory support Implements interfaces up to DDR333 for external memory connectivity (family capability documented in the LatticeXP data).
• Clock management Up to four analog PLLs per device for clock multiply/divide and phase shifting to support diverse timing domains.
• Power and temperature Supply voltage range: 1.71 V to 3.465 V. Commercial-grade operating temperature: 0 °C to 85 °C.
• Package and mounting Surface-mount 388-BBGA / 388-FPBGA (23 × 23 mm) package for dense board integration.
• Low-power and in-field update features Family features include a Sleep Mode for significant static current reduction and TransFR™ reconfiguration for in-field logic updates while the system operates.
• Standards and test support IEEE 1149.1 boundary-scan and onboard debug capabilities are provided at the family level for system test and verification.
• Environmental compliance RoHS compliant.

Typical Applications

• Embedded Control & Glue Logic Mid-density programmable fabric for consolidating control functions, protocol bridging and board-level glue logic.
• Memory Interface & Buffering Use the embedded RAM and DDR interface capability to implement memory controllers, FIFOs and data buffering between subsystems.
• High‑I/O Peripheral Aggregation Aggregate multiple sensor, I/O or peripheral interfaces into a single programmable device using the device’s 268 I/Os and flexible I/O standards.
• In-field Upgradable Systems Products that require secure, non-volatile configuration with the ability to update logic in the field while the system remains operational.

Unique Advantages

• Instant-on, non-volatile operation: Eliminates external configuration flash and enables near-instant system start-up.
• High I/O density in a compact package: 268 I/Os in a 388‑ball BGA reduces board-level routing complexity for multi‑interface designs.
• Integrated memory resources: Approximately 0.33 Mbits of embedded RAM combined with distributed memory options simplifies buffering and state storage without external SRAM.
• In-field reconfiguration capability: TransFR™ support enables logic updates while a system is running, facilitating field upgrades and feature addition.
• Flexible clocking and DDR support: Up to four PLLs and DDR interface capability support multi-domain timing and external memory connectivity.
• Commercial temperature and RoHS compliance: Designed for commercial applications with standard operating temperature range and environmental compliance.

Why Choose LFXP15C-3FN388C?

The LFXP15C-3FN388C brings a balance of mid-range logic capacity, substantial on-chip memory and a large I/O complement within a compact 388‑ball BGA package. Its non-volatile, instant-on architecture and in-field reconfiguration features support designs that need secure, quick-start operation and the ability to evolve in the field.

This device is well suited to developers and teams building embedded systems that require flexible I/O interfacing, on-board memory resources and predictable commercial‑temperature operation, backed by the LatticeXP family’s documented capabilities for clock management, testability and DDR interfacing.

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