LFXP15C-3F484C

IC FPGA 300 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA

Quantity 759 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O300Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15C-3F484C – XP Field Programmable Gate Array, 15,000 logic elements, 300 I/Os

The LFXP15C-3F484C is a Lattice XP family FPGA offering non-volatile, reconfigurable logic in a 484-ball BGA package. With 15,000 logic elements, approximately 0.332 Mbits of embedded RAM and up to 300 I/Os, it targets system-level designs that require dense logic, flexible I/O and on-chip memory.

Designed for commercial applications, the device supports instant-on operation, in-field reconfiguration and multiple supply voltages, enabling compact, integrated implementations where fast startup, memory interfaces and flexible signaling are required.

Key Features

  • Logic Capacity 15,000 logic elements provide a mid-range fabric suitable for complex glue logic, protocol bridging and embedded control functions.
  • Embedded Memory Total on-chip RAM of 331,776 bits (approximately 0.332 Mbits) with distributed and block memory resources for data buffering and state storage.
  • I/O and Package Up to 300 general-purpose I/Os in a 484-BBGA (484-FPBGA, 23 × 23 mm) surface-mount package, enabling high-density board integration.
  • Voltage Flexibility Operates across a wide supply range from 1.71 V to 3.465 V to support mixed-voltage systems and common I/O standards.
  • Non-volatile, Instant-on Architecture Non-volatile FPGA fabric with instant-on capability (powers up in microseconds) and no external configuration memory required.
  • Reconfiguration and Low Power In-field TransFR™ reconfiguration for updating logic while a system operates, plus a Sleep Mode that can reduce static current by up to 1000×.
  • Clocking Up to four analog PLLs per device for clock multiplication, division and phase shifting to support complex timing domains.
  • I/O Standards Programmable sysIO™ buffer supporting LVCMOS (1.2/1.5/1.8/2.5/3.3 V), LVTTL, SSTL, HSTL, PCI and high-speed differential options such as LVDS and LVPECL for flexible interfacing.
  • DDR Memory Support Dedicated DDR interface capability up to DDR333 (166 MHz) for external memory connectivity and buffering.
  • Commercial Grade Temperature Rated for 0 °C to 85 °C operating temperature for commercial applications.
  • Compliance RoHS compliant for environmental and regulatory adherence.

Typical Applications

  • Embedded Control and Glue Logic Use the device for consolidating discrete logic, implementing control state machines and offloading CPU tasks with its 15,000 logic elements and on-chip RAM.
  • Memory Interface and Buffering Dedicated DDR support combined with block and distributed RAM makes the FPGA suitable for memory controller logic and data buffering in systems that require external DDR connections.
  • High-Density I/O and Protocol Bridging Up to 300 programmable I/Os and broad sysIO™ standard support enable protocol conversion, interface bridging and multi-voltage I/O expansion.
  • Fast-Startup Systems Instant-on non-volatile architecture is well suited to applications that require rapid power-up and immediate logic availability without external configuration memory.

Unique Advantages

  • Non-volatile FPGA Fabric: Eliminates the need for external configuration memory and provides instant-on behavior, simplifying board design and securing configuration data.
  • Flexible I/O Signaling: Programmable sysIO™ supports many single-ended and differential standards, reducing the need for level translators and external interface components.
  • In-field Reconfiguration: TransFR™ capability allows logic updates while the system remains operational, enabling field upgrades and iterative development.
  • Low-Power Modes: Sleep Mode reduces static current by up to 1000×, helping lower standby power in battery-assisted or energy-conscious designs.
  • Integrated Clock Management: Up to four PLLs on-chip enable flexible clock domain generation without external clock synthesis components.
  • Compact, High-Density Package: 484-ball fpBGA (23 × 23 mm) offers a high I/O count in a compact footprint for space-constrained designs.

Why Choose LFXP15C-3F484C?

The LFXP15C-3F484C positions itself as a mid-density, non-volatile FPGA solution that balances logic capacity, embedded memory and broad I/O flexibility. Its instant-on behavior, in-field reconfiguration and dedicated DDR support make it suitable for system designers who need fast startup, memory interfacing and adaptable I/O in a single device.

This commercial-grade FPGA is a practical choice for engineers building embedded systems, interface bridges and memory-centric designs that benefit from integrated PLLs, reduced BOM due to on-chip configuration and RoHS compliance for environmental requirements.

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