LFXP10E-5FN256C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 221184 10000 256-BGA |
|---|---|
| Quantity | 148 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1216 | Number of Logic Elements/Cells | 10000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 221184 |
Overview of LFXP10E-5FN256C – XP Field Programmable Gate Array (FPGA) IC 188 221184 10000 256-BGA
The LFXP10E-5FN256C is a non-volatile LatticeXP FPGA in a 256-ball fpBGA package, offering 10,000 logic elements, 188 I/Os and on-chip RAM totaling 221,184 bits. Built for commercial-grade embedded designs, this surface-mount FPGA combines instant-on non-volatile configuration with flexible I/O and in-field reconfiguration capabilities.
Targeted at system designers who need reconfigurable logic with integrated memory and versatile interface support, the device delivers rapid start-up, low standby modes and a compact 17 × 17 mm package for space-constrained boards.
Key Features
- Core Logic — 10,000 logic elements provide the combinational and sequential resources for mid-density FPGA designs.
- On-chip Memory — Approximately 0.22 Mbits (221,184 bits) of embedded RAM for data buffering, state storage and small memory blocks.
- I/O and Package — 188 user I/Os in a 256-FPBGA (17 × 17 mm) package; surface-mount mounting for compact board integration.
- Non-volatile, Instant-on Architecture — Built-in non-volatile configuration removes the need for external configuration memory and enables microsecond power-up behavior.
- In-field Reconfiguration (TransFR™) — Support for reconfiguring SRAM-based logic while the system is running to enable updates and feature changes without full downtime.
- Low-power Modes — Sleep mode capability offering up to 1000× static current reduction for reduced standby power consumption.
- Flexible I/O Standards — Datasheet-described sysIO™ buffer support includes LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS signaling options for broad interface compatibility.
- Power Supply — Core supply specified at 1.14 V to 1.26 V; datasheet notes device operation with common system supplies including 3.3 V, 2.5 V, 1.8 V and 1.2 V for I/O domains.
- Commercial Temperature Grade — Specified operating temperature from 0 °C to 85 °C suitable for commercial applications.
- Standards and Tools — Family-level support includes PLLs, boundary-scan (IEEE 1149.1) and on-chip logic analysis features as described in the device family datasheet.
- RoHS Compliant — Conforms to RoHS requirements for lead-free assembly.
Typical Applications
- Embedded Control and Glue Logic — Implement custom control, protocol bridging and glue logic between processors and peripherals using the device’s logic and I/O resources.
- Industrial Automation — Use for sensor interfacing, motor-control front-ends or fieldbus protocol handling where reconfigurability and fast power-up are beneficial.
- Communications and Interface Bridging — Leverage versatile I/O standards and on-chip memory for protocol converters, data buffering, and interface translations.
- Consumer and Commercial Electronics — Ideal for user-interface controllers, peripheral aggregation and customization in space-constrained consumer and commercial products.
Unique Advantages
- Instant-on Non-volatile Configuration: Eliminates external configuration memory and enables rapid system start-up.
- In-field Update Capability: TransFR™ reconfiguration supports updating logic while the system is operational, reducing maintenance windows.
- Low Standby Power: Sleep mode can reduce static current by up to 1000×, supporting energy-conscious designs.
- Wide Interface Flexibility: Broad sysIO™ buffer support enables many signaling standards without additional level-shifting components.
- Compact, High-density Package: 256-FPBGA (17 × 17 mm) provides high I/O count and logic density in a compact surface-mount form factor.
- Commercial-grade Robustness: Operates across a 0 °C to 85 °C range and is RoHS compliant for standard commercial deployments.
Why Choose LFXP10E-5FN256C?
The LFXP10E-5FN256C combines non-volatile, instant-on FPGA architecture with mid-range logic capacity (10,000 logic elements), broad I/O support and integrated on-chip RAM to deliver a flexible, space-efficient solution for embedded and interface applications. Its sleep mode, in-field reconfiguration and compact 256-FPBGA package make it suitable for designs that require fast start-up, field updates and a small board footprint.
This device is well suited to commercial product developers and system integrators who need a balance of logic density, embedded memory and versatile I/O in a reconfigurable, RoHS-compliant FPGA backed by family-level features documented in the LatticeXP datasheet.
If you would like pricing, availability or a formal quote for LFXP10E-5FN256C, submit a request or contact sales for expedited assistance.