LFXP10E-4FN256I

The LFXP10E-4FN256I is a non-volatile FPGA from Lattice Semiconductor designed for industrial applications requiring reconfigurable logic, embedded memory and flexible I/O in a compact 256-ball fpBGA package. Based on the LatticeXP family architecture, this device delivers instant-on, in-system reconfiguration and system-level features suitable for embedded systems, industrial control and communications equipment.

Key on-chip resources include 10,000 logic elements, approximately 0.22 Mbits of embedded memory, and 188 user I/Os, all in a surface-mount 256-FPBGA (17×17 mm) package rated for industrial temperature operation.

Key Features

• Core Architecture Non-volatile, infinitely reconfigurable LatticeXP family architecture with instant-on capability and in-field reconfiguration.
• Logic Capacity 10,000 logic elements providing a mid-range programmable fabric for control, glue logic and moderate-density datapaths.
• Embedded Memory Approximately 0.22 Mbits of on-chip embedded RAM (EBR) with support for distributed and block memory resources for data buffering and state storage.
• I/O and Interface Flexibility 188 I/Os with programmable sysIO™ buffer support for a broad range of interface standards described in the family datasheet (including common CMOS, LVDS and memory interfaces).
• Dedicated Memory Interface Family-level support for dedicated DDR memory interfaces (DDR333 capability referenced in the LatticeXP family documentation).
• Clocking Up to four analog PLLs per device for clock multiplication, division and phase shifting as described in the LatticeXP family data.
• Power Management Support for sleep mode (family feature) for significant static current reduction and a device supply range specified at 1.14 V to 1.26 V for the LFXP10E-4FN256I.
• Package & Mounting 256-ball fpBGA (256-FPBGA, 17×17 mm) surface-mount package for dense board integration.
• Industrial Temperature Grade Qualified for operation from −40 °C to 100 °C and RoHS compliant.

Typical Applications

• Industrial Control Implement control logic, motor interfaces and deterministic I/O handling in temperature-demanding environments.
• Embedded Systems Integrate glue logic, protocol bridging and custom peripherals while taking advantage of instant-on and in-field reconfiguration.
• Communications Equipment Manage I/O aggregation, protocol conversion and memory interface logic using the device’s flexible I/O and PLL resources.
• Test & Measurement Deploy programmable logic for custom timing, data capture and preprocessing tasks with on-chip memory and reconfiguration capability.

Unique Advantages

• Instant-on, non-volatile operation: Eliminates the need for external configuration memory and enables fast start-up.
• In-field reconfiguration: Reconfigure SRAM-based logic quickly to update functionality without removing the device from-system.
• Compact, high-density package: 256-FPBGA (17×17 mm) package packs 188 I/Os and integrated resources into a small board area.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding environments.
• Flexible power and I/O options: Device supply specified at 1.14–1.26 V and programmable I/O buffers (family capability) enable mixed-signal interface designs.
• RoHS compliant: Aligns with environmental and manufacturing requirements.

Why Choose LFXP10E-4FN256I?

The LFXP10E-4FN256I delivers a balanced combination of logic density, embedded memory and I/O count in a compact industrial-grade package. It is well suited for designers who need instant-on, reconfigurable logic with the ability to update designs in the field while meeting industrial temperature requirements.

With family-level features such as dedicated DDR support, multiple PLLs and flexible I/O buffering alongside the device’s 10,000 logic elements and approximately 0.22 Mbits of embedded RAM, this FPGA is a practical choice for mid-density embedded applications that require integration, configurability and long-term design flexibility.

Request a quote or submit a pricing request to evaluate LFXP10E-4FN256I for your next design and confirm availability and lead times for production planning.