LFXP10E-3FN388C

The LFXP10E-3FN388C is a non-volatile, reconfigurable FPGA from the LatticeXP family, packaged in a 388-ball fpBGA (23 × 23 mm) surface-mount package. It integrates approximately 10,000 logic elements and approximately 0.22 Mbits of on-chip RAM with 244 I/O pins to support dense, flexible system designs that require instant-on behavior, in-field reconfiguration and a wide range of I/O standards.

Key Features

• Core Architecture — Non-volatile, reconfigurable: Instant-on operation with no external configuration memory required and secure bitstream storage; supports reconfiguration of SRAM-based logic in milliseconds.
• Logic Capacity: Approximately 10,000 logic elements suitable for mid-density implementations and on-chip system glue logic.
• Embedded Memory: Approximately 0.22 Mbits of on-chip RAM delivered as flexible distributed and block memory resources for data buffering and local storage.
• I/O Flexibility: 244 general-purpose I/Os in the 388-BBGA package with programmable sysIO buffer support for multiple interface standards (LVCMOS 3.3/2.5/1.8/1.5/1.2, LVTTL, various SSTL/HSTL classes, PCI, LVDS, LVPECL, RSDS as listed in the family datasheet).
• Clocking: Up to four analog PLLs per device for clock multiplication, division and phase shifting to support complex timing domains.
• Memory Interface: Dedicated DDR memory support up to DDR333 (166 MHz) for external memory interfaces.
• Power and Sleep: Core supply range specified at 1.14 V to 1.26 V; family-level sleep mode enables significant static current reduction (up to 1000× as documented in the datasheet).
• Package & Mounting: 388-ball fpBGA (23 × 23 mm) surface-mount package suitable for compact board layouts; commercial-grade device with operating range 0 °C to 85 °C.
• Standards & Tools: System-level support noted in the family datasheet including IEEE 1149.1 boundary scan and onboard configuration features for development and debug.
• Compliance: RoHS compliant.

Typical Applications

• Communications Interfaces: Implement protocol bridging, SERDES-friendly I/O standards and DDR memory interfaces where flexible I/O and programmable clocking are required.
• Embedded Control & Glue Logic: Replace discrete logic with a single FPGA to consolidate bus arbitration, signal conditioning and control functions.
• Memory Subsystem Front-End: Use the dedicated DDR support and on-chip RAM for buffering and timing alignment to external memory.
• Industrial & Commercial Systems: Implement in-field logic updates and instant-on startup for equipment where quick availability and maintainability are valuable.

Unique Advantages

• Instant-on Non-volatile Architecture: Eliminates the need for external configuration memory and enables immediate device readiness after power-up.
• In-field Reconfiguration (TransFR): Update logic while the system is running to deploy fixes or feature updates without board-level modification.
• Flexible I/O and Clocking: Broad programmable I/O standards plus up to four PLLs let you match interface and timing needs without additional components.
• Compact, High-density Package: 388-ball fpBGA (23 × 23 mm) provides 244 I/Os and high integration in a space-efficient form factor.
• Power Management: Core voltage range of 1.14–1.26 V and a datasheet-specified sleep mode enable efficient power profiles for battery-assisted or low-power systems.
• Commercial Temperature Range: Rated for 0 °C to 85 °C to meet a broad set of commercial and industrial-adjacent applications.

Why Choose LFXP10E-3FN388C?

The LFXP10E-3FN388C balances mid-range logic density with extensive I/O and embedded memory, delivering a compact, non-volatile FPGA suited to designs that need instant-on behavior, flexible interfaces and in-field update capability. Its 388-ball fpBGA package and 244 I/Os make it a practical choice for consolidating system logic and interfacing to external memory and high-speed peripherals while keeping board area constrained.

This device is well matched to engineers and teams building commercial-grade systems that require reconfigurability, programmable clocking and a robust set of I/O standards, with the long-term advantages of in-field updates and a documented family ecosystem for design tools and IP.

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