LFXP10E-4FN256C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 221184 10000 256-BGA |
|---|---|
| Quantity | 63 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1216 | Number of Logic Elements/Cells | 10000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 221184 |
Overview of LFXP10E-4FN256C – XP Field Programmable Gate Array (FPGA) — 10,000 logic elements, 188 I/Os, 256‑BGA
The LFXP10E-4FN256C is a Lattice XP family FPGA designed for compact, reconfigurable logic applications. It integrates 10,000 logic elements with on-chip embedded memory and high-density I/O in a 256‑ball fpBGA (17 × 17 mm) package. Targeted at commercial applications, the device delivers non‑volatile, instantly available FPGA functionality with system-level features for in-field reconfiguration and low-power standby.
Key Features
- Core Capacity — 10,000 logic elements and 1,216 logic block units as specified, enabling mid-range logic integration for control, protocol bridging, and custom logic functions.
- Embedded Memory — Approximately 0.216 Mbits (221,184 bits) of on-chip RAM for distributed and block memory use in data buffering and state storage.
- I/O and Packaging — 188 user I/Os in a 256‑FPBGA (17 × 17 mm) surface‑mount package, providing a compact footprint with substantial external connectivity.
- Non‑volatile, Instant‑On Architecture — LatticeXP family non‑volatile technology provides instant‑on operation and eliminates the need for external configuration memory.
- In‑field Reconfiguration & Security — Supports reconfiguration while in-system (TransFR™) and design protection through on‑chip non‑volatile configuration.
- Clocking — Family support for up to four analog PLLs enables clock multiplication, division and phase shifting for complex timing domains.
- Power and Voltage — Core supply range specified at 1.14 V to 1.26 V; device supports surface‑mount assembly and is RoHS compliant.
- Operating Range — Commercial grade operation from 0 °C to 85 °C for standard commercial applications.
Typical Applications
- Embedded Control Systems — Implement custom control logic, timing-critical state machines and protocol conversion using the device’s 10,000 logic elements and on‑chip RAM.
- Communication Interfaces — Use the abundant I/O and flexible clocking resources to implement interface bridging, SERDES supporting logic, and timing-handling blocks.
- Industrial and Commercial Equipment — Integrate configurable logic for user interfaces, sensor aggregation, and local data preprocessing in compact form factors.
- In‑field Upgradeable Systems — Take advantage of non‑volatile instant‑on and TransFR reconfiguration to perform firmware upgrades or feature updates without external configuration memory.
Unique Advantages
- Instant Configuration: Non‑volatile architecture provides immediate availability at power‑up and removes the need for external configuration components.
- Flexible Reconfiguration: In‑field TransFR reconfiguration enables firmware updates and logic changes while the system is operational.
- Compact, High‑I/O Package: 188 I/Os in a 256‑ball fpBGA (17 × 17 mm) package helps minimize PCB area while maintaining connectivity.
- On‑chip Memory Resources: Approximately 0.216 Mbits of embedded RAM supports local buffering and state retention without external memory.
- Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.
Why Choose LFXP10E-4FN256C?
The LFXP10E-4FN256C positions itself as a mid-density, non‑volatile FPGA for commercial designs that need instant availability, in‑field reconfiguration and a balanced mix of logic, memory and I/O. Its 10,000 logic elements, substantial embedded RAM and 188 I/Os in a compact 256‑FPBGA package make it suitable for embedded control, communications interfacing and other applications where board area and configurability matter.
Designed within the LatticeXP family, the device benefits from family-level features such as sleep mode for static current reduction, programmable PLLs for clock management, and a flexible I/O infrastructure—offering a pragmatic combination of integration and system-level capability for long‑term design flexibility.
Request a quote or submit your procurement inquiry to receive pricing, availability and lead‑time information for the LFXP10E-4FN256C. Our team can assist with volume needs, sample requests and technical clarification to support your design schedule.