LFXP10E-3FN256C

The LFXP10E-3FN256C is a commercial-grade, non-volatile LatticeXP family FPGA optimized for mid-density logic integration and system-level configurability. Built on the LatticeXP architecture, the device combines approximately 10,000 logic elements with on-chip embedded RAM and a flexible I/O fabric to support a wide range of commercial embedded designs.

This package-level offering is suited for applications that require instant-on operation, in-field reconfiguration, and dense I/O connectivity. Key device attributes include 1,216 internal logic blocks, roughly 0.22 Mbits of on-chip RAM, 188 I/Os, and a compact 256-ball fpBGA (17 × 17 mm) package.

Key Features

• Core logic — Approximately 10,000 logic elements and 1,216 internal logic blocks provide mid-range programmable logic capacity for control, glue logic, and moderate-complexity processing tasks.
• On-chip memory — Approximately 0.22 Mbits of total on-chip RAM supports embedded data buffering, state storage, and localized memory functions without external SRAM for many designs.
• I/O density and flexibility — 188 user I/Os in a 256-ball fpBGA package provide extensive board-level connectivity. Family-level sysIO support includes multiple I/O standards to accommodate varied voltage domains and interfaces.
• Non-volatile, instant-on architecture — LatticeXP family non-volatile technology enables instant-on behavior and eliminates the need for external configuration memory, simplifying system boot and securing configuration data.
• In-field reconfiguration and power modes — Supports system-level reconfiguration and a sleep mode that can significantly reduce static current draw during low-power operation.
• Clocking and timing — Up to four analog PLLs per device (family-level) enable clock multiplication, division, and phase shifting for complex timing domains.
• Power and packaging — Core supply range 1.14 V to 1.26 V; devices ship in a 256-FPBGA (17 × 17 mm) surface-mount package and are rated for commercial operating temperatures (0 °C to 85 °C).
• Compliance — RoHS-compliant manufacturing.

Typical Applications

• Commercial embedded systems — Implements control logic, protocol bridging, and board-level sequencing in consumer and commercial products that require compact programmable logic.
• Memory interface and buffering — On-chip RAM and dedicated DDR memory support (family-level) enable implementation of memory controllers, data buffering, and interface logic.
• High-density I/O designs — 188 I/Os in a compact fpBGA package make the device suitable for applications needing broad parallel connectivity or multiple I/O standards.
• Field-updatable systems — TransFR reconfiguration and instant-on capability support in-field logic updates and rapid system restarts for deployed commercial equipment.

Unique Advantages

• Instant-on non-volatile operation: Eliminates external configuration memory and shortens boot time for systems that require immediate availability after power-up.
• In-field reconfiguration: TransFR capability enables logic updates while the system is in the field, reducing service downtime and enabling feature upgrades.
• Balanced integration: Mid-range logic (≈10,000 elements) combined with on-chip RAM and up to 188 I/Os reduces BOM and simplifies board-level design.
• Flexible clocking: Multiple PLLs allow designers to manage multiple clock domains without external clocking components.
• Compact packaging: 256-FPBGA (17 × 17 mm) surface-mount package provides high I/O density in a small footprint for space-constrained designs.
• Commercial-grade readiness and RoHS compliance: Designed for commercial temperature ranges and manufactured to RoHS standards for global deployments.

Why Choose LFXP10E-3FN256C?

The LFXP10E-3FN256C positions itself as a practical mid-density FPGA option for engineers who need a non-volatile, instant-on solution with a balanced mix of logic, embedded memory, and I/O density. Its LatticeXP family capabilities—such as in-field reconfiguration, multiple PLLs, and flexible I/O standards—make it suitable for commercial embedded designs that benefit from rapid boot, secure configuration, and field updates.

Designers targeting compact, board-level integration will find the 256-ball fpBGA package and 188 I/Os useful for conserving PCB space while maintaining connectivity. The device is supported by Lattice family-level design tools and IP resources, helping accelerate development and enable scalability across similar device densities.

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