LFXP10C-4FN388I

The LFXP10C-4FN388I is a non-volatile, reconfigurable FPGA from the LatticeXP family. It integrates approximately 10,000 logic elements with embedded and distributed memory, flexible I/O support and on-chip system features tailored for industrial-grade embedded and system-level designs.

Built around ispXP non-volatile technology, this device offers instant-on operation, in-field reconfiguration and a compact 388-ball FBGA package (23 × 23 mm) suitable for designs that require high I/O density (244 I/Os) and broad supply voltage flexibility.

Key Features

• Core Capacity — Approximately 10,000 logic elements implemented across 1,216 internal logic blocks (PFU/PFF total), providing mid-range logic density for control, interface and system integration tasks.
• Embedded and Distributed Memory — Approximately 221,184 total RAM bits (about 216 Kbits) of embedded block SRAM and support for distributed RAM (device family table indicates 39 Kbits distributed RAM for the LFXP10 device).
• Flexible I/O and Standards — 244 user I/Os with programmable sysIO buffer options documented for a wide range of standards including LVCMOS, LVTTL, SSTL, HSTL, PCI and common differential I/O families (LVDS, Bus-LVDS, LVPECL, RSDS).
• Configuration and Reconfiguration — Non-volatile ispXP architecture with instant-on and in-field TransFR reconfiguration (TFR) capabilities; designs can be reconfigured in-system via configuration and JTAG ports.
• Clocking and DDR Support — Up to four analog PLLs for clock multiply/divide and phase shifting; dedicated DDR memory interface support up to DDR333 (166 MHz) as indicated in the family documentation.
• Low-Power & Power Modes — Sleep mode support for significant static current reduction and multi-voltage operation (device supply range specified at 1.71 V to 3.465 V).
• Package & Thermal — 388-ball FBGA (23 × 23 mm) package, industrial-grade operating temperature from −40 °C to 100 °C, and surface-mount mounting.
• System-Level Support — IEEE 1149.1 boundary-scan support, onboard oscillator for configuration, and internal logic analysis capability via ispTRACY as documented for the family.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Industrial-grade temperature range and high I/O count enable sensor interfacing, protocol bridging and control logic in industrial systems.
• Embedded System Integration — On-chip non-volatile configuration, instant-on behavior and flexible I/O support make the device suitable for embedded controllers and system glue logic.
• Memory-Interface Designs — Dedicated DDR memory interface support and multiple PLLs allow implementation of DDR-based subsystems and synchronized interfaces.
• High-Density I/O Applications — 244 user I/Os in a 388-BBGA package support designs requiring many parallel or mixed-signal interfaces, including differential pairs and standardized I/O families.

Unique Advantages

• Instant-on Non-Volatile Architecture: Eliminates the need for external configuration memory and enables immediate operation at power-up.
• In-Field Reconfiguration (TFR): Allows logic updates while the system is operating, supporting incremental feature upgrades and field fixes.
• Broad I/O Flexibility: Programmable I/O buffers and support for multiple interface standards reduce external interface components and simplify board-level design.
• Integrated Clocking: Up to four analog PLLs provide versatile clock management for multi-domain and high-speed interfacing.
• Industrial Operating Range: Specified −40 °C to 100 °C operation combined with RoHS compliance supports long-term use in industrial deployments.
• Tool and IP Support: Family documentation references ispLEVER tools and pre-designed ispLeverCORE modules to aid design productivity and shorten development cycles.

Why Choose LFXP10C-4FN388I?

The LFXP10C-4FN388I positions itself as a mid-density, industrial-grade FPGA offering a balance of logic capacity, embedded memory and high I/O count in a compact 388-BBGA package. Its non-volatile ispXP architecture, instant-on behavior and in-field reconfiguration capabilities address system designs that need secure, fast startup and flexible update paths without external configuration memory.

Designers targeting industrial and embedded applications that require a mix of memory interfaces, a variety of I/O standards, and reliable operation across −40 °C to 100 °C will find this device suitable for reducing BOM complexity while leveraging documented tool and IP support from the LatticeXP family.

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