LFXP10C-4F256I

The LFXP10C-4F256I is a member of the LatticeXP family of non-volatile, reconfigurable FPGAs. It combines on-chip logic, embedded memory and flexible I/O in a compact 256-ball fpBGA package for industrial-grade designs.

With approximately 10,000 logic elements, 188 I/O pins and roughly 0.22 Mbits of embedded RAM, this device targets industrial applications that require instant-on configuration, secure on-chip storage and a broad supply voltage range for mixed-voltage systems.

Key Features

• Logic Capacity  Approximately 10,000 logic elements and 1,216 internal logic blocks provide a balanced fabric for mid-density logic implementations.
• Embedded Memory  About 221,184 bits (≈0.22 Mbits) of on-chip RAM to support data buffering, lookup tables and small embedded memories.
• I/O and Package  188 programmable I/Os in a 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package for dense, board-level integration.
• Voltage Support  Wide supply range of 1.71 V to 3.465 V to accommodate multiple I/O standards and mixed-voltage system environments.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial temperature requirements.
• Non-volatile Architecture (Family Feature)  LatticeXP family supports non-volatile, instant-on operation without external configuration memory, enabling fast boot and enhanced design security.
• Reconfiguration and Power Modes (Family Feature)  Family-level capabilities include in-field reconfiguration and a sleep mode that enables significant static current reduction.
• Clocking and System Support (Family Feature)  Family devices support multiple analog PLLs and system-level features such as boundary scan and internal logic analysis.
• RoHS Compliant  Device meets RoHS environmental requirements.

Typical Applications

• Industrial Control  Use where robust I/O counts, industrial temperature range and on-chip logic are required for machine control, motor drives and automation interfaces.
• Embedded System Glue Logic  Flexible I/O voltage support and mid-range logic density make this FPGA suitable for protocol bridging, signal conditioning and peripheral aggregation.
• Communications and Networking  Instant-on, reconfigurable logic and plentiful I/O enable adaptable packet processing, interface conversion and system-level timing tasks.

Unique Advantages

• Instant-on, non-volatile operation: Eliminates the need for external configuration memory and enables rapid system startup.
• Compact, board-friendly package: 256-ball fpBGA (17 × 17 mm) provides a high I/O count in a small footprint for space-constrained designs.
• Wide supply range: 1.71 V–3.465 V support allows integration with multiple I/O standards and mixed-voltage system domains.
• Industrial temperature rating: −40 °C to 100 °C operation targets industrial deployments that require extended temperature tolerance.
• On-chip memory and logic balance: Approximately 0.22 Mbits of embedded RAM paired with ~10,000 logic elements supports data buffering and mid-density feature sets without external memory.

Why Choose LFXP10C-4F256I?

The LFXP10C-4F256I delivers a practical balance of logic capacity, embedded memory and I/O density in a non-volatile FPGA architecture designed for industrial applications. Its instant-on behavior and family-level reconfiguration capabilities reduce board-level complexity by removing the need for external configuration storage while supporting secure, rapid system start-up.

This device is well suited for engineering teams implementing mid-density FPGA functions—protocol bridging, system glue logic, industrial control and communications—where package density, voltage flexibility and extended temperature range are key selection criteria.

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