LFXP10C-3FN388I

The LFXP10C-3FN388I is a non-volatile LatticeXP family Field Programmable Gate Array (FPGA) offering 10,000 logic elements and 244 general-purpose I/Os in a 388-ball BGA package. It combines reconfigurable logic, embedded memory, and flexible high-performance I/O to address demanding embedded and industrial designs.

Designed for industrial environments, this device supports a wide supply range (1.71 V to 3.465 V) and an operating temperature range of −40 °C to 100 °C, delivering instant-on capability, in-field reconfiguration, and system-level features that simplify board-level design and secure configuration.

Key Features

• Non-volatile, infinitely reconfigurable  LatticeXP family architecture provides non-volatile configuration with instant-on behavior and the ability to reconfigure SRAM-based logic in milliseconds.
• Instant-on and secure configuration  Powers up in microseconds and does not require external configuration memory, reducing BOM and protecting design bitstreams from read-back.
• In-field reconfiguration (TransFR™)  Supports in-system logic updates while the system operates for flexible field upgrades and incremental feature deployment.
• Logic capacity  10,000 logic elements for mid-density designs requiring substantial combinational and sequential resources.
• Embedded memory  221,184 total RAM bits—approximately 0.22 Mbits of embedded memory—plus support for distributed and block memory architectures.
• I/O flexibility  244 I/Os in the 388-ball fpBGA package with programmable I/O buffer support across multiple standards (LVCMOS, LVTTL, SSTL, HSTL, LVDS, PCI and others described for the LatticeXP family).
• Clocking  Up to four analog PLLs per device for clock multiply/divide and phase shifting (LatticeXP family capability).
• Low-power modes  Sleep mode can dramatically reduce static current (family datasheet specifies up to 1000× reduction).
• Industrial readiness  Grade: Industrial with an operating temperature range of −40 °C to 100 °C and RoHS compliance.
• Package and mounting  388-BBGA (supplier package: 388-FPBGA, 23 × 23 mm), surface-mount for compact, high-density board designs.

Typical Applications

• Industrial control and automation  Use for real-time I/O aggregation, protocol bridging, and control logic where industrial temperature range and robust I/O counts are required.
• Communications and networking  Ideal for interface consolidation, protocol conversion, and data-path processing leveraging flexible I/O standards and embedded memory.
• Instrumentation and test equipment  Deploy for data acquisition front-ends and custom signal processing where instant-on and in-field updates simplify maintenance and upgrades.
• Embedded systems  Suitable for control planes, custom peripherals, and offload tasks that benefit from reconfigurable logic and compact BGA packaging.

Unique Advantages

• Reduced system BOM: Non-volatile configuration eliminates the need for external configuration memory, simplifying board design and lowering parts count.
• Fast start-up: Instant-on capability enables near-immediate availability after power-up, useful for systems that require rapid boot or recovery.
• Field flexibility: In-field reconfiguration (TransFR™) and reprogrammable SRAM-based logic allow feature upgrades and fixes without board replacement.
• High I/O density in a compact footprint: 244 I/Os in a 23 × 23 mm 388-FPBGA package provides extensive interfacing capability in a space-efficient package.
• Industrial-grade robustness: Rated for −40 °C to 100 °C and RoHS compliant for reliable operation in harsh environments.
• Integrated system support: On-chip PLLs and flexible memory resources enable complete subsystem implementations with fewer external components.

Why Choose LFXP10C-3FN388I?

The LFXP10C-3FN388I balances mid-range logic capacity (10,000 logic elements) with extensive I/O (244 pins) and integrated memory to support diverse embedded and industrial applications. Its non-volatile, instant-on architecture reduces system complexity while providing secure, reconfigurable logic, and the industrial operating range supports deployment in demanding environments.

This device is well suited to engineers and teams seeking a compact, reprogrammable FPGA solution that simplifies board-level design, supports field updates, and provides flexible interface options for a broad set of use cases.

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