LFXP10C-3FN256I

The LFXP10C-3FN256I from Lattice Semiconductor is an XP family Field Programmable Gate Array (FPGA) in a 256-ball fpBGA (17 × 17 mm) surface-mount package. The device combines non-volatile, reconfigurable logic with embedded memory and flexible I/O to support system-level designs.

With 10,000 logic elements, 221,184 bits (216 Kbits) of on-chip RAM, 188 user I/Os and a wide supply range (1.71 V to 3.465 V), this industrial-grade FPGA targets embedded and industrial applications that require instant-on configuration, in-field reconfiguration and robust temperature performance from −40 °C to 100 °C.

Key Features

• Non-volatile, instant-on architecture  Device uses re-programmable non-volatile technology that requires no external configuration memory and supports instant-on power-up in microseconds.
• Reconfiguration and in-field updates  Supports reconfiguration of SRAM-based logic in milliseconds and TransFR™ reconfiguration for in-field logic updates while the system operates.
• Logic capacity  Provides 10,000 logic elements suitable for mid-density FPGA functions and integration.
• Embedded memory  Approximately 0.216 Mbits (221,184 bits / 216 Kbits) of on-chip RAM including distributed and block memory resources.
• Flexible I/O and voltage support  188 I/O pins with programmable buffer options and multi-rail operation across the 1.71 V to 3.465 V supply range.
• Dedicated DDR memory interface and high-speed I/O  Implements interface support up to DDR333 and a range of high-performance I/O signaling options.
• Clocking  Up to four analog PLLs for clock multiply, divide and phase shifting to support complex timing requirements.
• Power and low-power modes  Includes a sleep mode for substantial static current reduction during low-power states.
• System-level support  IEEE 1149.1 boundary-scan plus onboard debug features such as an internal logic analyzer and onboard oscillator for configuration.
• Package and temperature  256-FPBGA (17 × 17 mm), surface mount; industrial temperature grade from −40 °C to 100 °C; RoHS compliant.

Typical Applications

• Industrial automation  Industrial-grade operation and −40 °C to 100 °C temperature range make the device suitable for control, I/O aggregation and automation systems requiring reliable operation across wide environments.
• Embedded systems and instant-on designs  Non-volatile instant-on capability and no external configuration memory simplify power-up behavior for embedded controllers and instrumentation.
• Memory interface and communications  Dedicated DDR interface support, flexible I/O and multiple PLLs enable bridging, buffering and protocol handling in networking and data-path applications.
• Field-updatable systems  TransFR reconfiguration and fast SRAM reprogramming support in-field logic updates without complete system downtime.

Unique Advantages

• Instant-on non-volatile configuration: Eliminates external configuration memory and enables rapid power-up behavior.
• Integrated memory and logic: 10,000 logic elements and 216 Kbits of embedded RAM reduce external BOM and simplify board-level memory planning.
• High I/O density in a compact package: 188 I/Os in a 256-FPBGA (17 × 17 mm) provide abundant connectivity while maintaining a small PCB footprint.
• Flexible voltage and I/O standards: Wide supply range (1.71 V–3.465 V) and programmable buffer support provide flexibility across mixed-voltage systems.
• Robust system features: Multiple PLLs, DDR support and system-level tools such as boundary-scan and internal logic analyzer facilitate complex designs and debug.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployments in demanding environmental conditions.

Why Choose LFXP10C-3FN256I?

The LFXP10C-3FN256I delivers a balanced combination of non-volatile instant-on configuration, mid-range logic capacity and flexible I/O in an industrial-grade package. Its integrated memory, PLLs and DDR interface capability make it well suited for embedded and industrial systems that require reliable start-up, in-field reconfigurability and compact board-level integration.

Designed for engineers who need a reconfigurable, system-ready FPGA with strong system-level features and wide operating range, this device offers a practical path to reduce external components while preserving flexibility for future updates and feature expansion.

Request a quote or submit an inquiry for pricing and availability of the LFXP10C-3FN256I. Our team can provide lead-time and order support to meet your project schedule.