LFXP10C-3FN388C

The LFXP10C-3FN388C is a non-volatile LatticeXP family FPGA in a 388‑ball BGA package designed for commercial embedded applications. The device integrates approximately 10,000 logic elements and on-chip memory to implement control, interfacing and data-path functions while supporting flexible I/O and in-field reconfiguration.

This surface-mount FPGA is optimized for systems requiring instant-on capability, reconfigurable logic and a broad I/O complement, all within a 23×23 mm fpBGA footprint.

Key Features

• Non-volatile, instant-on architecture – Powers up in microseconds with no external configuration memory required and provides design security by eliminating an external bitstream.
• Reconfigurable logic – Approximately 10,000 logic elements for implementing control, glue logic and datapath functions; supports SRAM-based reconfiguration for rapid updates.
• Embedded memory – Total on-chip RAM of 221,184 bits (approximately 216 Kbits) to support FIFOs, buffers and local storage.
• Flexible I/O – 244 user I/Os in a 388‑BBGA package to support diverse signaling and board integration.
• Analog clocking – Up to 4 analog PLLs to support clock multiplication, division and phase shifting for system timing needs.
• In-field update capability (TransFR™) – Enables logic updates while the system is operating to simplify field upgrades and feature rollouts.
• Low-power features – Sleep mode can reduce static current by orders of magnitude for power-sensitive designs.
• Supply and environmental specs – Operates over a supply range of 1.71 V to 3.465 V and a commercial temperature range of 0 °C to 85 °C.
• Package and mounting – 388‑ball fpBGA (23×23 mm) in a surface-mount package for compact board layouts.

Typical Applications

• Commercial embedded systems – Implement control logic, glue functions and feature-rich peripherals in compact, instant-on designs.
• Communications equipment – Use the device’s PLLs and flexible I/O to handle interface bridging, protocol conversion and timing tasks.
• Consumer and industrial control – Integrate user interface control, sensor aggregation and local processing with on-chip memory and reconfigurability.
• Field-upgradable products – Enable in-field logic updates to add features or fix firmware-level issues without replacing hardware.

Unique Advantages

• Integrated non-volatile FPGA: Eliminates the need for external configuration memory and enables secure, instant-on operation.
• Balanced logic and memory: Approximately 10,000 logic elements combined with 221,184 bits of on-chip RAM reduce external component count and board complexity.
• Wide I/O count in a compact package: 244 I/Os in a 23×23 mm fpBGA provide high pin density for complex interfacing while minimizing PCB area.
• Field reconfiguration: TransFR™ capability allows live updates to logic, helping extend product life and accelerate feature deployment.
• Flexible clocking: Up to four PLLs provide the timing control necessary for multi-domain systems and high-performance interfaces.
• Commercial temperature and supply flexibility: Supports a 1.71 V–3.465 V supply range and 0 °C–85 °C operation to match a wide range of commercial applications.

Why Choose LFXP10C-3FN388C?

The LFXP10C-3FN388C delivers a compact, non-volatile FPGA solution that combines a sizable logic fabric with substantial on-chip RAM and a high I/O count. Its instant-on behavior, sleep-mode power savings and in-field reconfiguration capabilities make it well suited for commercial systems that require fast startup, update flexibility and reduced BOM complexity.

This device is appropriate for designers seeking a commercially graded FPGA with integrated memory, multiple PLLs and flexible I/O in a 388‑ball fpBGA package. It offers a practical balance of performance, integration and reconfigurability backed by the LatticeXP family architecture.

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