LFXP10C-3FN256C

The LFXP10C-3FN256C is a non-volatile XP family FPGA in a 256-ball fpBGA (17 × 17 mm) package designed for reconfigurable system logic. It integrates approximately 10,000 logic elements organized across 1,216 logic blocks with about 221,184 bits of on-chip RAM and 188 user I/O pins to address medium-density embedded and system-level designs.

Built for instant-on operation without external configuration memory, the device supports in-field reconfiguration, low-power sleep mode, and flexible I/O signaling to simplify board-level integration and accelerate time-to-market.

Key Features

• Core Capacity — Approximately 10,000 logic elements organized across 1,216 logic blocks to implement medium-density digital functions and control logic.
• Embedded Memory — Approximately 221,184 bits of on-chip RAM for distributed and block memory usage in data buffering, state storage, and small FIFOs.
• I/O and Interfaces — 188 user I/Os with programmable sysIO buffer support for a wide range of signaling standards, enabling flexible interfacing to external peripherals and memory.
• Non‑volatile, Instant‑On Configuration — ispXP non-volatile technology eliminates the need for external configuration memory and delivers microsecond power-up behavior and design security.
• Reconfiguration and Field Upgrades — Supports reconfiguration of SRAM-based logic in milliseconds and TransFR™ reconfiguration for in-field logic updates while the system operates.
• Power and Low-Power Modes — Sleep mode provides significant static current reduction (up to 1000× as specified in family documentation) to support low-power system states.
• Clocking and Timing — Family-level support for up to four analog PLLs to manage clock multiplication, division, and phase shifting for complex timing domains.
• Package and Mounting — 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package for compact board integration.
• Supply and Temperature — Operates from 1.71 V to 3.465 V and specified for commercial temperature range 0 °C to 85 °C.
• Compliance — RoHS compliant for environmentally conscious designs.

Typical Applications

• Embedded system control — Implement custom control logic, protocol handling, and glue logic in compact system designs using the device’s logic and memory resources.
• Field‑upgradeable systems — Use TransFR™ reconfiguration and fast reconfiguration of SRAM-based logic to deploy in-field updates and feature upgrades without external configuration memory.
• High-density I/O bridging — Leverage the 188 user I/Os and programmable sysIO buffers to interface between processors, sensors, and memory subsystems with diverse signaling standards.

Unique Advantages

• Instant-on, non-volatile operation — Eliminates external configuration memory and reduces system boot time by powering up in microseconds.
• In-field reconfiguration capability — Update or modify logic while the system is running to extend product lifetime and enable feature updates.
• Flexible I/O signaling — Programmable I/O buffers accommodate multiple interface standards for broader compatibility with existing peripherals.
• Compact, board-friendly package — 256-ball fpBGA (17 × 17 mm) offers a high I/O count in a small footprint to minimize PCB area.
• Power management options — Sleep mode supports greatly reduced static current for applications requiring low-power standby.
• Commercial temperature and broad supply range — Operates across typical commercial ambient conditions with a wide supply voltage range for flexible system design.

Why Choose LFXP10C-3FN256C?

The LFXP10C-3FN256C combines a mid-range logic capacity with substantial embedded memory and a high I/O count in a compact fpBGA package. Its non-volatile, instant-on architecture and support for in-field reconfiguration reduce system complexity by removing external configuration memory while enabling rapid feature updates. The device’s programmable I/O and on-chip clocking resources help integrate diverse interfaces and manage complex timing requirements without extensive external circuitry.

This FPGA is well suited to engineers and teams developing embedded and system-level designs that need a balance of logic density, memory, flexible I/O, and reconfigurability with commercial-grade temperature and RoHS compliance.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical support for the LFXP10C-3FN256C.