LFX500EB-04F516I

The LFX500EB-04F516I is an ispXPGA® family Field Programmable Gate Array (FPGA) from Lattice Semiconductor. It provides a mid-density programmable logic fabric with a mix of logic elements, embedded memory, and a high I/O count for system integration.

With 2,704 logic elements, approximately 0.11 Mbits of embedded RAM, and 336 user I/O pins in a compact 516-ball BGA package, this device is targeted at designs that require moderate logic capacity, significant I/O connectivity, and industrial temperature operation.

Key Features

• ispXPGA® FPGA core Device is part of the ispXPGA family providing a programmable logic architecture suitable for custom digital functions.
• Logic capacity 2,704 logic elements to implement custom state machines, glue logic, or moderate combinational/sequential logic functions.
• Embedded memory Approximately 0.11 Mbits (113,664 bits) of on-chip RAM for buffering, small FIFOs, or parameter storage.
• I/O density 336 user I/O pins to support wide parallel interfaces, bus bridging, or multiple serial/concurrent peripheral connections.
• Gate equivalent 476,000 gates providing a view of overall device logic scale for system partitioning and resource planning.
• Power supply Operates from a 2.3 V to 3.6 V supply range to accommodate common system voltage domains.
• Package & mounting 516-ball FPBGA (516-BBGA) 31 × 31 mm package, surface-mount for compact board-level integration.
• Industrial temperature range Rated for −40 °C to 105 °C operation for reliable performance across demanding environmental conditions.
• Regulatory RoHS compliant.

Typical Applications

• Custom logic and glue-logic — Use the 2,704 logic elements and 336 I/Os to implement system glue, protocol adapters, and control logic between multiple subsystems.
• I/O bridging and protocol interfacing — High I/O count supports parallel bus bridging, FPGA-based interface conversion, and multi-channel signaling.
• Embedded control and small-scale signal processing — On-chip RAM and logic resources enable buffering, control state machines, and modest data-path processing.
• Compact system integration — 516-ball BGA package allows dense board-level integration where board space and I/O routing are constrained.

Unique Advantages

• Balanced logic and I/O mix: Provides 2,704 logic elements alongside 336 I/Os to support designs that require both logic density and extensive connectivity.
• Embedded RAM for local buffering: Approximately 0.11 Mbits of on-chip memory reduces external memory dependence for small FIFOs and parameter storage.
• Industrial temperature rating: −40 °C to 105 °C operation helps ensure stable behavior in harsh or wide-temperature environments.
• Flexible supply range: 2.3 V to 3.6 V operation allows compatibility with common system power rails.
• Compact BGA package: 516-ball FPBGA (31 × 31 mm) delivers high pin-count in a surface-mount form factor for space-constrained designs.
• RoHS compliant: Conforms to lead-free manufacturing and environmental requirements.

Why Choose LFX500EB-04F516I?

The LFX500EB-04F516I offers a practical balance of logic resources, embedded memory, and high I/O density in a compact 516-ball BGA package, delivered with industrial temperature capability and RoHS compliance. It is well suited for designers who need mid-range programmable logic with substantial connectivity and board-level integration flexibility.

As a member of the ispXPGA family, this device provides measurable resource counts—2,704 logic elements, 113,664 bits of RAM, 336 I/Os, and 476,000 gate equivalents—allowing straightforward resource planning and system partitioning for embedded and control-oriented designs.

If you would like pricing or availability for LFX500EB-04F516I, request a quote or submit an inquiry to purchase this ispXPGA FPGA.