LFX200EC-03FN256I

The LFX200EC-03FN256I is an ispXPGA® Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation packaged in a 256-ball BGA (17×17) surface-mount device. It provides a programmable logic fabric with 2,704 logic elements, approximately 0.114 Mbits of embedded RAM, and a gate count of 210,000 for implementing custom digital functions.

Designed for industrial applications, this FPGA offers 172 user I/Os, a wide supply range (2.3 V to 3.6 V), and an operating temperature range of −40 °C to 105 °C, making it suitable for embedded and control systems that require moderate-density logic, flexible I/O, and industrial temperature capability.

Key Features

• Core Logic  Provides 2,704 logic elements for implementing custom combinational and sequential logic, with a total gate equivalent of 210,000.
• Embedded Memory  Includes 113,664 bits of on-chip RAM (approximately 0.114 Mbits) for buffer, FIFO, and small data storage needs.
• I/O Resources  172 user-accessible I/O pins to support multiple peripheral interfaces and board-level connectivity.
• Power  Operates from a 2.3 V to 3.6 V supply range, supporting common single-supply system architectures.
• Package & Mounting  256-ball FBGA (17×17) surface-mount package for compact board-level integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 105 °C to meet industrial-environment requirements.
• Compliance  RoHS compliant, meeting standard hazardous-substance restrictions for electronic components.

Typical Applications

• Industrial Control  Implement custom control logic and glue functions in industrial automation systems, leveraging the industrial temperature rating and robust I/O count.
• Embedded Systems  Provide configurable logic and small embedded memory for embedded controllers, protocol handling, or peripheral aggregation.
• Interface Bridging  Use the 172 I/Os to implement parallel/serial interface conversions, signal conditioning, or bus bridging on compact PCBs.
• Prototyping and Custom Logic  Deploy as a mid-density FPGA for prototyping tailored digital blocks or offloading functions from microcontrollers.

Unique Advantages

• Balanced Logic Density: 2,704 logic elements and a 210,000-gate equivalent provide a practical balance between capability and board-level cost for mid-density designs.
• On-Chip Memory: Approximately 0.114 Mbits of embedded RAM reduces the need for external memory for small buffers and FIFOs, simplifying BOM and layout.
• High I/O Count: 172 user I/Os enable flexible interfacing with sensors, peripherals, and external devices without additional multiplexing logic.
• Industrial-Grade Operation: Rated for −40 °C to 105 °C and RoHS compliant, supporting deployment in industrial and temperature-challenging environments.
• Compact Package: 256-ball FBGA (17×17) surface-mount package provides a compact footprint for space-constrained designs.
• Wide Supply Range: 2.3 V to 3.6 V operation accommodates common supply domains and eases integration with mixed-voltage systems.

Why Choose LFX200EC-03FN256I?

The LFX200EC-03FN256I offers a configurable FPGA solution from Lattice Semiconductor Corporation that combines moderate logic capacity, embedded memory, and a high I/O count in a compact 256-BGA package. Its industrial operating temperature range and RoHS compliance make it appropriate for embedded and industrial designs that require reliable, place-and-route programmable logic.

This device is well suited to designers and procurement teams seeking a mid-density, I/O-rich FPGA for custom logic, interface bridging, and embedded control tasks. Its combination of resources supports scalable designs while keeping board complexity and external components to a minimum.

Request a quote or contact sales to discuss pricing, availability, and how the LFX200EC-03FN256I can meet your project requirements.