LFX200EB-04FN256I

The LFX200EB-04FN256I is an ispXPGA® Field Programmable Gate Array (FPGA) IC designed for flexible, reconfigurable logic in industrial applications. It provides 2,704 logic elements and 113,664 bits of on-chip RAM complemented by 160 user I/O pins to implement custom digital functions and interfaces.

Built for surface-mount deployment in a compact 256-ball BGA (256-FPBGA, 17×17), this device supports a 2.3 V to 3.6 V power supply range and an operating temperature range of -40 °C to 105 °C, matching industrial temperature requirements and enabling reliable operation in demanding environments.

Key Features

• Core Logic 2,704 logic elements to implement custom combinational and sequential logic functions and moderate-density designs.
• On-chip Memory 113,664 bits of embedded RAM for temporary storage, buffering, and small lookup tables within user designs.
• I/O Capacity 160 user I/O pins to support multiple parallel interfaces and peripheral connections in compact systems.
• Gate Count Approximately 210,000 gates providing the gate-level capacity to integrate glue logic, protocol handling, and control functions.
• Power Wide supply range from 2.3 V to 3.6 V to accommodate common system power rails.
• Package & Mounting 256-ball FPBGA (17×17) package, surface-mount mounting type for high-density PCB assembly.
• Industrial Temperature Range Rated for operation from -40 °C to 105 °C, suitable for industrial-grade deployments.
• Environmental Compliance RoHS compliant to meet regulatory and environmental requirements.

Typical Applications

• Industrial Control & Automation Leverages the device’s industrial temperature rating and 160 I/O to implement control logic, sensor interfacing, and machine control functions.
• Embedded System Glue Logic Use the 2,704 logic elements and on-chip RAM to consolidate glue logic, protocol bridges, and custom peripheral interfaces, reducing board-level complexity.
• Communications & Interface Bridging Employ available I/Os and gate capacity to implement protocol translation, parallel/serial bridging, and timing-critical interface logic.

Unique Advantages

• Compact BGA Footprint: 256-ball FPBGA (17×17) package enables dense board layouts while providing abundant I/O for complex connectivity.
• Industrial Temperature Capability: Rated from -40 °C to 105 °C to support deployment in harsh or temperature-sensitive environments.
• Flexible Power Range: Operates across a 2.3 V to 3.6 V supply range to integrate easily with common system rails.
• Balanced Logic and Memory: 2,704 logic elements combined with 113,664 bits of RAM support a wide range of mid-density logic and buffering tasks.
• Regulatory Compliance: RoHS compliant for environmentally conscious designs and manufacturing requirements.
• Proven ispXPGA Family: Part of the ispXPGA device family as documented in the device datasheet, providing familiar architecture for existing designs.

Why Choose LFX200EB-04FN256I?

The LFX200EB-04FN256I positions itself as a versatile mid-density FPGA solution for industrial and embedded applications that require moderate logic capacity, on-chip memory, and a significant number of I/O in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for designs that demand reliability across a wide thermal range.

Designers and procurement teams seeking a reconfigurable, surface-mount FPGA with a balanced combination of logic elements, RAM, and I/O can leverage this device to consolidate discrete logic, simplify board design, and accommodate a variety of interface requirements while maintaining industrial operating conditions.

Request a quote or submit a pricing inquiry to receive availability and ordering information for the LFX200EB-04FN256I.