LFX200EB-05F256C

The LFX200EB-05F256C is an ispXPGA® field programmable gate array (FPGA) from Lattice Semiconductor Corporation, provided in a 256‑ball BGA package. It offers 2,704 logic elements, 113,664 bits of on‑chip RAM (approximately 0.11 Mbits), and 160 general-purpose I/O for configurable digital designs in commercial applications.

With a 2.3 V to 3.6 V supply range, surface-mount 256‑FPBGA (17 × 17) packaging, and a commercial operating temperature range of 0 °C to 85 °C, this device targets designers who need configurable logic density and on‑chip memory in a compact, RoHS‑compliant package.

Key Features

• Core Logic 2,704 logic elements provide programmable combinational and sequential resources for custom digital functions.
• Embedded Memory 113,664 bits of on‑chip RAM (approximately 0.11 Mbits) for buffering, lookup tables, and small data storage without external memory.
• I/O Density 160 available I/O pins support a wide range of external interfacing and signal routing in a single device.
• Gate Equivalent 210,000 gates of implementation capacity for mapping medium-scale logic designs.
• Power and Voltage Operates from 2.3 V to 3.6 V to match common commercial supply rails.
• Package and Mounting 256‑BGA package (supplier package: 256‑FPBGA, 17 × 17) with surface‑mount mounting for compact PCB integration.
• Operating Range and Grade Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance RoHS‑compliant construction.

Typical Applications

• Embedded Systems Use the programmable logic and on‑chip RAM for custom control, glue logic, and peripheral interfacing in commercial products.
• Prototyping and Development Implement and iterate custom logic functions and I/O configurations during system development and testing.
• I/O Expansion Provide flexible signal routing and protocol adaptation where 160 programmable I/O lines are required.

Unique Advantages

• Balanced Logic Density: 2,704 logic elements and 210,000 gate capacity enable medium-scale logic integration without external ASICs.
• On‑Chip Memory: Approximately 0.11 Mbits of embedded RAM reduces reliance on external memory for buffering and LUT storage.
• High I/O Count: 160 I/O pins provide flexibility for connecting multiple peripherals, interfaces, and sensors.
• Compact BGA Packaging: 256‑ball FPBGA (17 × 17) package allows dense PCB layouts and surface‑mount assembly.
• Commercial Voltage Flexibility: 2.3 V to 3.6 V supply range accommodates common commercial power rails.
• Regulatory Compliance: RoHS‑compliant materials support environmentally conscious product designs.

Why Choose LFX200EB-05F256C?

The LFX200EB-05F256C delivers a practical combination of logic elements, embedded RAM, and I/O capacity in a compact 256‑BGA footprint for commercial designs. Its voltage range, surface‑mount BGA packaging, and RoHS compliance make it suitable for applications that require configurable logic and moderate on‑chip memory without increasing PCB area.

Designers and procurement teams seeking a commercially graded ispXPGA® FPGA with clear, verifiable specifications for logic density, memory, I/O, and operating range will find the LFX200EB-05F256C an appropriate choice for mid‑range programmable logic needs.

Request a quote or submit a pricing inquiry for the LFX200EB-05F256C to receive availability and lead‑time information tailored to your project requirements.