LFX200EB-04FH516C

The LFX200EB-04FH516C is an ispXPGA® Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation designed for mid-density programmable logic applications. It combines 2,704 logic elements with 113,664 bits of on-chip RAM, 240 user I/O pins and approximately 210,000 gates in a 256-ball FPBGA (17 × 17 mm) package.

This commercial-grade, surface-mount FPGA operates from a 2.3 V to 3.6 V supply and supports an ambient temperature range of 0 °C to 85 °C, making it suitable for a wide range of standard electronic designs that require moderate logic capacity, on-chip memory and high I/O density.

Key Features

• Core Logic  2,704 logic elements and roughly 210,000 gates provide programmable combinational and sequential logic resources for custom digital functions.
• Embedded Memory  113,664 bits of on-chip RAM support buffering, state storage and lookup-table implementations without external memory.
• I/O Density  240 user I/O pins accommodate broad interfacing requirements for peripherals, buses and external devices.
• Power  Single supply operation from 2.3 V to 3.6 V simplifies power-rail design and integration with common supply domains.
• Package & Mounting  256-ball FPBGA (17 × 17 mm) surface-mount package enables compact board-level integration where high pin count is required.
• Operating Range  Commercial operating temperature range of 0 °C to 85 °C for standard electronic environments.
• Compliance  RoHS compliant environmental status for lead-free manufacturing processes.

Typical Applications

• Custom digital glue logic  Use the device to consolidate multiple discrete components into programmable logic with up to 240 I/O and 2,704 logic elements.
• Peripheral interfacing  High I/O count and on-chip RAM make it suitable for adapting and buffering external sensors, displays or serial interfaces.
• Prototyping and feature integration  Embedded memory and moderate gate count support rapid implementation of prototype functions and integration of specialized features on compact PCBs.

Unique Advantages

• Balanced logic and memory resources: 2,704 logic elements paired with 113,664 bits of RAM enable both logic-intensive and memory-assisted functions on a single device.
• High I/O capacity: 240 user I/O pins reduce the need for external I/O expanders and simplify board routing for multi-interface designs.
• Compact BGA packaging: 256-ball FPBGA (17 × 17 mm) delivers high pin density in a small footprint for space-constrained boards.
• Simple power requirements: Operation from a single 2.3 V–3.6 V supply streamlines power-supply design across mixed-voltage systems.
• Lead-free manufacturing ready: RoHS compliance supports modern assembly and manufacturing processes.

Why Choose LFX200EB-04FH516C?

The LFX200EB-04FH516C is positioned as a mid-density, commercial-grade FPGA that combines ample logic capacity, embedded RAM and a high I/O count in a compact BGA package. It is well suited for designers who need to consolidate discrete logic, implement custom peripheral interfaces or prototype new functions without moving to larger, more complex devices.

Choosing this Lattice Semiconductor ispXPGA device offers a practical balance of integration and board-level efficiency, backed by a RoHS-compliant part and straightforward power and thermal characteristics for standard electronic product development.

Request a quote or submit a pricing inquiry today to get started with the LFX200EB-04FH516C for your next design.