LFX200EB-04F256C

The LFX200EB-04F256C is an ispXPGA® family FPGA from Lattice Semiconductor Corporation offered in a 256‑ball BGA (17×17) surface‑mount package. It provides a mid‑range logic capacity and on‑chip memory suitable for embedded logic, interface integration, and prototype development.

Designed for commercial‑grade applications, the device operates from a 2.3 V to 3.6 V supply and across a 0 °C to 85 °C ambient temperature range, balancing integration and power flexibility for board‑level designs.

Key Features

• Logic Capacity 2,704 logic elements with an architecture delivering approximately 210,000 gates for mid‑range programmable logic tasks.
• Embedded Memory Approximately 0.11 Mbits of on‑chip RAM (113,664 total RAM bits) to support buffering, small lookup tables, and state storage without external memory.
• I/O Count 160 general‑purpose I/Os to enable multiple peripheral interfaces and board‑level signaling options.
• Power and Temperature Single supply operation from 2.3 V to 3.6 V and commercial operating range of 0 °C to 85 °C for typical embedded deployments.
• Package and Mounting 256‑BGA package (supplier package: 256‑FPBGA, 17×17) with surface‑mount mounting for compact PCB integration.
• Standards and Compliance RoHS‑compliant construction; device is listed in the ispXPGA family datasheet as an active/orderable LFX200EB device.

Typical Applications

• Embedded Logic and Glue‑Logic Use the LFX200EB-04F256C to implement custom combinational or sequential logic, protocol bridging, and board‑level control where moderate gate count and I/O density are required.
• Interface Concentration With 160 I/Os, the device can consolidate multiple peripheral interfaces and translate between different signal domains on a single PCB.
• Prototyping and Development The ispXPGA family device is suitable for rapid prototyping of control and signal‑processing functions within the commercial temperature range.

Unique Advantages

• Balanced Logic and Memory: 2,704 logic elements paired with approximately 0.11 Mbits of embedded RAM enable compact implementations without requiring large external memories.
• High I/O Density: 160 I/Os support multi‑interface designs and reduce the need for external I/O expanders.
• Compact Surface‑Mount Package: 256‑BGA (17×17) packaging allows high functional density in space‑constrained PCB layouts.
• Flexible Power Range: 2.3 V to 3.6 V supply range supports a variety of board power architectures.
• Commercial Temperature Rating: Qualified for 0 °C to 85 °C operation for standard commercial applications.
• Vendor and Family Support: Part of the ispXPGA family from Lattice Semiconductor as documented in the family datasheet.

Why Choose LFX200EB-04F256C?

The LFX200EB-04F256C offers a practical mix of logic capacity, embedded memory, and I/O count in a compact 256‑BGA package for commercial embedded designs. Its voltage and temperature ranges make it suitable for a broad set of board‑level applications where mid‑range programmable logic and on‑chip resources reduce external component needs.

Engineers and designers seeking a commercially rated, RoHS‑compliant ispXPGA family device from Lattice Semiconductor will find this part appropriate for integration, prototyping, and interface consolidation tasks that require a balance of gates, memory, and I/O density.

Request a quote or submit an inquiry for pricing and lead‑time information to evaluate the LFX200EB-04F256C for your next design.