LFX200EB-03F516I

The LFX200EB-03F516I is an ispXPGA® field programmable gate array (FPGA) designed for industrial embedded applications. It combines 2,704 logic elements, approximately 0.114 Mbits of embedded memory, and a 240-pin I/O capability in a compact 256-BGA package to support custom digital logic, I/O aggregation and system integration.

With a supply voltage range of 2.3 V to 3.6 V and an operating temperature range of −40 °C to 105 °C, this FPGA targets robust designs where temperature tolerance, flexible supply options, and a high density of I/O and logic resources are required.

Key Features

• Core Logic  2,704 logic elements providing the programmable fabric for implementing custom digital logic and state machines.
• Embedded Memory  Approximately 113,664 bits (≈0.114 Mbits) of on-chip RAM for buffering, FIFOs and small lookup tables.
• I/O Capacity  240 user I/Os to support dense interfacing with sensors, peripherals and external devices.
• Gate Density  210,000 gates of combinational and sequential resources for medium-complexity digital designs.
• Power and Supply  Wide supply range from 2.3 V to 3.6 V to accommodate different system power domains and I/O standards.
• Package and Mounting  256-BGA (256-FPBGA, 17 × 17 mm) surface-mount package for compact board layouts and high pin density.
• Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 105 °C to meet demanding environmental requirements.
• Compliance  RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Industrial Control  Use the device’s industrial temperature range and robust I/O count for control logic, signal conditioning and automation interfaces.
• I/O-Intensive Systems  High pin count (240 I/Os) enables aggregation and translation between multiple sensors, actuators and peripheral buses.
• Embedded Logic and Prototyping  2,704 logic elements and on-chip RAM support custom logic development, prototyping and small-scale accelerators.

Unique Advantages

• Balanced Logic and Memory: Combines 2,704 logic elements with approximately 113,664 bits of embedded RAM to support control and data buffering within a single device.
• High I/O Density: 240 I/Os enable flexible interfacing options and simplify board-level signal routing for multi-peripheral designs.
• Wide Supply Range: Operates from 2.3 V to 3.6 V, allowing integration into various system power architectures without extensive level shifting.
• Industrial Temperature Rating: −40 °C to 105 °C operation provides thermal margin for deployments in harsh or variable environments.
• Compact BGA Package: The 256-FPBGA (17 × 17 mm) package delivers high pin count in a small footprint for space-constrained PCBs.
• RoHS Compliant: Meets lead-free manufacturing requirements for modern production processes.

Why Choose LFX200EB-03F516I?

The LFX200EB-03F516I delivers a practical combination of logic capacity, embedded memory and a large I/O complement in a compact 256-BGA package. Its industrial temperature rating and flexible supply range make it a suitable choice for embedded designs that require reliable operation across a wide set of environmental and power conditions.

This FPGA is well suited for engineers and teams building mid-density programmable logic solutions that need on-chip RAM, extensive I/O and a compact package—providing a straightforward path to integrate custom logic without significant board real estate or complex power constraints.

Request a quote or submit an inquiry today to get pricing and availability for LFX200EB-03F516I and begin integrating this ispXPGA® FPGA into your next design.