LFX200EB-03F256I

The LFX200EB-03F256I is an ispXPGA® family FPGA from Lattice Semiconductor designed for configurable digital logic in industrial environments. It provides a mid-range logic capacity with 2,704 logic elements and 676 CLBs, paired with on-chip memory and a broad I/O profile for interfacing and control tasks.

With 160 dedicated I/O pins, support for a 2.3 V to 3.6 V supply range, and an operating temperature range of −40 °C to 105 °C, this device targets industrial applications that require reliable, reprogrammable logic in a compact 256-BGA package.

Key Features

• Core Logic 2,704 logic elements organized across 676 CLBs provide reconfigurable logic resources for combinational and sequential designs.
• Embedded Memory 113,664 bits of on-chip RAM (approximately 0.114 Mbits) to support buffering, small lookup tables, and state storage without external memory.
• I/O Capacity 160 individual I/O pins enable extensive peripheral and bus interfacing for sensors, controllers, and communication links.
• Density & Gates Equivalent to 210,000 gates, offering a balance of integration for glue logic, protocol bridging, and mid-complexity FPGA functions.
• Package & Mounting 256-BGA (supplier package: 256-FPBGA, 17×17) in a surface-mount format for space-efficient PCB integration.
• Power & Supply Supports a supply voltage range of 2.3 V to 3.6 V to accommodate common industrial logic domains.
• Industrial Temperature Grade Rated for an operating temperature range of −40 °C to 105 °C to meet demanding thermal environments.
• Compliance RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Industrial Control Use the programmable logic and robust temperature rating for sensor interfacing, control sequencing, and real-time glue logic in factory automation equipment.
• Communications & Networking 160 I/Os and on-chip RAM enable protocol adapters, interface bridging, and packet-handling support in communication modules and network appliances.
• Embedded System Integration Integrate peripheral aggregation, custom interfaces, and timing logic on-board to reduce external components and simplify PCB layouts.

Unique Advantages

• Balanced Logic Capacity: 2,704 logic elements with 676 CLBs provide a practical mid-range resource set for many embedded designs without unnecessary overhead.
• On-chip Memory: Approximately 0.114 Mbits of embedded RAM reduces dependence on external memory for small buffers and state machines, simplifying BOM and layout.
• High I/O Count: 160 I/Os support multiple peripherals and bus interfaces directly from the FPGA, cutting the need for external level shifters and expanders.
• Industrial Temperature Range: Operation from −40 °C to 105 °C supports deployment in harsh or outdoor industrial environments.
• Compact BGA Package: 256-BGA (17×17 FPBGA) enables a space-efficient footprint while maintaining a high pin count for connectivity.
• Flexible Supply Range: 2.3 V to 3.6 V compatibility fits common system power rails for straightforward board-level integration.

Why Choose LFX200EB-03F256I?

The LFX200EB-03F256I provides a pragmatic combination of logic density, on-chip memory, and I/O capacity within the ispXPGA family, tailored for industrial applications that require reprogrammable logic in a compact package. Its industrial temperature rating and RoHS compliance make it suitable for long-term deployment in controlled harsh environments.

This device is a good fit for engineers and system designers who need a mid-range FPGA to consolidate interfaces, offload control tasks from microcontrollers, or implement custom logic without large external component counts, all backed by Lattice Semiconductor’s ispXPGA family documentation.

Request a quote or submit a parts inquiry to obtain pricing and availability for the LFX200EB-03F256I and support details relevant to your project requirements.