LFX200B-04FH516C

The LFX200B-04FH516C is an ispXPGA® Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation offered in a 256-ball BGA package. It provides a commercial-grade, reprogrammable logic device with 2,704 logic elements, approximately 113,664 bits of embedded memory and 240 user I/O pins, targeted at general FPGA use in commercial electronic designs.

With a 2.3 V to 3.6 V supply range and an operating temperature range of 0 °C to 85 °C, this device is intended for designs that require moderate logic capacity, on-chip RAM and a high I/O count in a compact surface-mount 17 × 17 mm package.

Key Features

• Core Architecture  ispXPGA® FPGA device offering 2,704 logic elements for implementing custom digital logic and state machines.
• Embedded Memory  Approximately 113,664 bits of on-chip RAM to support buffering, LUTs, and small data storage needs.
• I/O Capacity  240 user I/O pins provide broad external connectivity for interfacing with peripherals, sensors, and other ICs.
• Logic Density  Device reports approximately 210,000 gates, enabling moderate-complexity logic integration on a single chip.
• Package and Mounting  256-ball FPBGA (17 × 17 mm) package, surface-mount, suited for compact board layouts.
• Power Range  Flexible voltage supply from 2.3 V to 3.6 V to accommodate a range of commercial system power rails.
• Operating Range  Commercial-grade operation from 0 °C to 85 °C for typical commercial electronic environments.
• Environmental Compliance  RoHS-compliant construction for regulatory and manufacturing consistency.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic, glue logic, or peripheral interfacing in commercial electronic products that require reprogrammable logic.
• Prototyping and Development  Use as a compact, reprogrammable platform for validating digital designs and proof-of-concept implementations.
• Interface Bridging  Handle protocol conversion and I/O aggregation using the device's 240 I/O pins and on-chip RAM for buffering.

Unique Advantages

• Balanced Logic and Memory:  2,704 logic elements paired with approximately 113,664 bits of embedded memory enable a mix of combinational and stateful designs without external RAM.
• High I/O Count:  240 user I/O pins reduce the need for additional multiplexing or external I/O expanders in I/O-heavy applications.
• Compact BGA Package:  256-ball FPBGA (17 × 17 mm) provides a high-density routing option for space-constrained PCBs.
• Commercial Temperature Range:  Rated for 0 °C to 85 °C operation, suitable for standard commercial product deployments.
• Wide Supply Voltage Window:  2.3 V to 3.6 V support allows integration into designs with different supply schemes common in commercial electronics.
• RoHS Compliance:  Environmentally compliant manufacturing that aligns with common production requirements.

Why Choose LFX200B-04FH516C?

The LFX200B-04FH516C positions itself as a practical, commercial-grade FPGA option when designers need a balanced combination of logic density, embedded memory and a high pin count in a compact BGA package. Its specifications make it a suitable choice for commercial embedded designs, prototyping efforts and interface-centric applications where reprogrammability and I/O capacity matter.

Backed by Lattice Semiconductor Corporation, this device offers predictable electrical and thermal operating windows, RoHS compliance and a footprint suitable for compact board layouts—supporting designers who require scalable, reprogrammable logic in commercial products.

Request a quote or submit an inquiry today to evaluate LFX200B-04FH516C for your next commercial FPGA design.