LFX200B-04F256C
| Part Description |
ispXPGA® Field Programmable Gate Array (FPGA) IC 160 113664 2704 256-BGA |
|---|---|
| Quantity | 886 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 160 | Voltage | 2.3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 676 | Number of Logic Elements/Cells | 2704 | ||
| Number of Gates | 210000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 113664 |
Overview of LFX200B-04F256C – ispXPGA® Field Programmable Gate Array (FPGA) IC, 256-BGA, 160 I/O
The LFX200B-04F256C is an ispXPGA® family field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It provides a user-programmable fabric with 2,704 logic elements and approximately 0.114 Mbits of embedded memory for implementing custom digital logic and interfacing functions.
Designed for commercial embedded designs, this surface-mount FPGA offers 160 user I/O pins in a compact 256-ball FPBGA (17 × 17 mm) package and operates from a 2.3 V to 3.6 V supply across a 0 °C to 85 °C temperature range.
Key Features
- Logic Capacity 2,704 logic elements (cells) and approximately 210,000 equivalent gates provide a programmable fabric for custom digital logic implementations.
- Embedded Memory Approximately 113,664 bits of on-chip RAM (about 0.114 Mbits) for data buffering, state storage, and small lookup tables.
- I/O Density 160 user I/O pins to support multiple external interfaces and mixed-signal interconnect requirements.
- Package & Mounting 256-ball fine-pitch BGA (256-FPBGA, 17×17 mm) package; surface-mount for compact PCB assemblies.
- Power Flexible single-supply operation from 2.3 V to 3.6 V to match common board power domains.
- Operating Grade & Temperature Commercial grade with an operating range of 0 °C to 85 °C for typical consumer and industrial-adjacent environments.
- Standards Compliance RoHS compliant, supporting lead-free manufacturing processes.
Unique Advantages
- Balanced Logic and Memory: 2,704 logic elements combined with approximately 0.114 Mbits of embedded RAM enable compact implementations of control, glue-logic, and small data-path functions without external memory.
- High I/O Count in a Compact Package: 160 I/O pins in a 256-FPBGA (17×17) enable substantial external connectivity while maintaining a small PCB footprint.
- Flexible Voltage Support: 2.3 V to 3.6 V supply range provides compatibility with common 2.5 V and 3.3 V system domains.
- Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to match mainstream embedded product requirements.
- RoHS Compliant: Complies with RoHS requirements for lead-free assembly and regulatory alignment.
- Surface-Mount Assembly: 256-ball BGA surface-mount package simplifies automated PCB assembly for volume production.
Why Choose LFX200B-04F256C?
The LFX200B-04F256C delivers a compact, I/O-rich FPGA option within the ispXPGA® family, combining a programmable logic core, embedded RAM, and a 160-pin I/O interface in a 256-ball FPBGA package. Its electrical and thermal specifications—2.3 V to 3.6 V supply and 0 °C to 85 °C operation—make it suitable for commercial embedded designs requiring on-chip logic and moderate memory resources.
As a member of the ispXPGA family from Lattice Semiconductor Corporation, this device is supported by published documentation and datasheet material, helping engineers evaluate performance and integrate the device into production designs.
Request a quote or submit a product inquiry for the LFX200B-04F256C to receive pricing, availability, and technical assistance for your design requirements.