LFX200B-03F256C

The LFX200B-03F256C is an ispXPGA® family Field Programmable Gate Array (FPGA) packaged in a 256‑BGA (17 × 17 mm) surface‑mount package. It offers a mid‑range logic capacity with 2,704 logic elements and approximately 113,664 bits of on‑chip RAM, making it suitable for designs that require reprogrammable logic, embedded memory, and substantial I/O connectivity.

This device supports a power supply range of 2.3 V to 3.6 V, operates over a commercial temperature range of 0 °C to 85 °C, and is RoHS compliant. The ispXPGA family datasheet lists the LFX200B-03F256C as Active / Orderable.

Key Features

• Core Logic  Approximately 2,704 logic elements providing flexible programmable logic capacity for glue logic, control, and custom digital functions.
• On‑chip Memory  113,664 bits of embedded RAM (approximately 0.11 Mbits) for local buffering, state storage, and small data caches.
• I/O Count  160 user I/Os to support multiple external interfaces, parallel peripherals, and board‑level signal routing.
• Gate Equivalent  Specified at 210,000 equivalent gates to help assess integration density for target designs.
• Package & Mounting  256‑BGA (supplier package: 256‑FPBGA, 17×17 mm) in a surface‑mount form factor for compact PCB implementations.
• Power  Operates from 2.3 V to 3.6 V, enabling use with a range of common system supplies.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for standard embedded and consumer environments.
• Environmental Compliance  RoHS compliant to support regulatory requirements for lead‑free manufacturing.

Typical Applications

• Interface Bridging and Glue Logic  Use the 160 I/Os and 2,704 logic elements to implement protocol bridging, bus translation, and custom peripheral interfaces.
• Embedded Control and State Machines  Implement deterministic control logic and state machines with on‑chip RAM available for small data tables and buffering.
• Prototyping and Function Validation  The ispXPGA architecture and reprogrammable logic are well suited to iterative hardware prototyping and feature validation on compact PCBs.

Unique Advantages

• Balanced Logic and Memory:  The combination of approximately 2,704 logic elements and 113,664 bits of RAM enables mid‑range designs that require both logic density and local storage.
• High I/O Density:  With 160 I/Os in a 256‑BGA package, designers can route multiple external interfaces while keeping board footprint compact.
• Flexible Supply Range:  Support for 2.3 V to 3.6 V supplies allows integration into systems using common power rails.
• Compact Surface‑Mount Package:  The 256‑FPBGA (17×17) package provides a small form factor for space‑constrained applications without sacrificing I/O count.
• Commercial Temperature Suitability:  Rated for 0 °C to 85 °C operation to match typical embedded and consumer product environments.
• Regulatory Readiness:  RoHS compliance supports lead‑free manufacturing workflows.

Why Choose LFX200B-03F256C?

The LFX200B-03F256C provides a practical balance of programmable logic, embedded memory, and I/O capacity in a compact 256‑BGA package. Its supply voltage range and commercial temperature specification make it appropriate for a wide range of embedded designs that need reprogrammable logic and moderate integration without increasing PCB area.

Ideal for engineers building interface logic, control systems, or prototype hardware, this ispXPGA family device is listed as Active / Orderable in the manufacturer datasheet and delivers verifiable, mid‑range FPGA resources to help reduce system BOM and accelerate development cycles.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the LFX200B-03F256C.