LFX200B-05F256C

IC FPGA 160 I/O 256FBGA
Part Description

ispXPGA® Field Programmable Gate Array (FPGA) IC 160 113664 2704 256-BGA

Quantity 528 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O160Voltage2.3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs676Number of Logic Elements/Cells2704
Number of Gates210000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits113664

Overview of LFX200B-05F256C – ispXPGA® Field Programmable Gate Array (FPGA) IC 160 113664 2704 256-BGA

The LFX200B-05F256C is an ispXPGA® family FPGA delivered in a compact 256-BGA package for commercial embedded designs. It integrates 2,704 logic elements and approximately 113,664 bits (≈0.114 Mbits) of on-chip RAM alongside 160 general-purpose I/O pins to support mid-density programmable logic requirements.

Designed for commercial-grade applications, the device operates across a 2.3 V to 3.6 V supply range and a 0 °C to 85 °C ambient temperature range, offering a balance of integration and flexibility in a surface-mount, 256-FPBGA (17×17) footprint.

Key Features

  • Core Logic 2,704 logic elements providing programmable resources for custom digital logic implementations.
  • On-chip Memory Approximately 113,664 bits of embedded RAM for buffering, state storage, and small lookup tables.
  • I/O 160 I/O pins to connect peripherals, interfaces, and board-level signals without external multiplexing.
  • Logic Capacity Equivalent to approximately 210,000 gates for typical mid-density logic functions.
  • Package and Mounting 256-BGA package (supplier package: 256-FPBGA, 17×17) with surface-mount mounting for compact PCB integration.
  • Power Broad supply voltage tolerance from 2.3 V to 3.6 V to support varied system power domains.
  • Operating Range & Grade Commercial grade operation from 0 °C to 85 °C for standard commercial deployments.
  • Environmental Compliance RoHS compliant, supporting restricted-substance requirements for commercial products.

Unique Advantages

  • Mid-density programmable logic: 2,704 logic elements and ~210,000 gates provide a well-balanced resource set for control logic, glue logic, and moderate FPGA tasks.
  • Integrated on-chip RAM: Approximately 0.114 Mbits of embedded memory reduces external memory needs for buffering and small data structures.
  • High I/O count in compact package: 160 I/Os in a 256-FPBGA (17×17) footprint enables dense interfaces while conserving board area.
  • Flexible voltage support: 2.3 V to 3.6 V supply range facilitates integration with common commercial power rails.
  • Commercial temperature rating: Specified for 0 °C to 85 °C operation to match standard commercial deployment environments.
  • RoHS compliant: Meets common environmental and materials restrictions for commercial products.

Why Choose LFX200B-05F256C?

The LFX200B-05F256C provides a compact, commercial-grade ispXPGA FPGA option for designs requiring a mid-range mix of logic elements, embedded RAM, and a high pin count. Its combination of 2,704 logic elements, approximately 113,664 bits of on-chip memory, and 160 I/Os in a 256-FPBGA package supports a wide range of commercial embedded use cases where board space, I/O density, and integration matter.

Engineers and procurement teams seeking a programmable logic device with clear, verifiable specifications—power range, temperature rating, package details, and RoHS compliance—will find the LFX200B-05F256C suitable for stable, predictable integration into commercial products and prototypes.

Request a quote or submit a pricing and availability inquiry to receive detailed lead-time and purchasing information for the LFX200B-05F256C.

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