LFX200EB-03FH516C

The LFX200EB-03FH516C is an ispXPGA® Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation packaged in a 256-BGA. It provides a moderate logic density with 2,704 logic elements and approximately 113,664 bits of embedded memory, along with up to 240 I/O pins and an estimated 210,000 gates.

Designed for surface-mount PCB assembly, the device operates from a 2.3 V to 3.6 V supply and is specified for commercial temperature operation from 0 °C to 85 °C. The package is supplied in a 256-FPBGA (17×17) footprint and is RoHS compliant.

Key Features

• Core Logic  2,704 logic elements providing programmable digital logic capacity for mid-range designs.
• Embedded Memory  Approximately 113,664 bits of on-chip RAM to support buffers, FIFOs, and small data storage needs.
• I/O Density  Up to 240 user I/O pins to interface with peripherals, sensors, and external buses.
• Gate Count  Approximately 210,000 gates indicating overall silicon complexity and integration capability.
• Power Supply  Operates from 2.3 V to 3.6 V, suitable for a range of standard digital supply rails.
• Package & Mounting  256-BGA package (supplier: 256-FPBGA, 17×17) with surface-mount mounting for compact board designs.
• Temperature Grade  Commercial grade with operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for materials and manufacturing processes.

Typical Applications

• Interface Bridging and Peripheral Control  Use the 240 I/O pins to implement custom interface logic between sensors, displays, and microcontrollers.
• Data Buffering and Signal Processing  Leverage approximately 113,664 bits of on-chip RAM for temporary storage, buffering, and small data-path implementations.
• Mid-Range Logic Integration  Deploy the 2,704 logic elements and ~210,000 gates to consolidate glue logic and moderate-complexity state machines onto a single FPGA.

Unique Advantages

• Balanced Logic and Memory:  Combines 2,704 logic elements with approximately 113,664 bits of embedded RAM to support control logic and local data storage without external memory for many use cases.
• High I/O Count:  Up to 240 I/O pins provide flexibility for connecting multiple peripherals and parallel interfaces, reducing the need for external I/O expanders.
• Compact BGA Footprint:  The 256-FPBGA (17×17) package enables a compact PCB layout while maintaining a high pin count for dense designs.
• Wide Supply Range:  2.3 V to 3.6 V supply support allows integration into a variety of standard digital power domains.
• RoHS Compliant:  Meets RoHS requirements for environmentally conscious designs and regulatory compliance.
• Commercial Temperature Range:  Specified for 0 °C to 85 °C operation to suit mainstream commercial electronic products.

Why Choose LFX200EB-03FH516C?

The LFX200EB-03FH516C positions itself as a commercially graded, mid-range FPGA solution from Lattice Semiconductor Corporation that balances logic capacity, embedded memory, and I/O density in a compact 256-BGA package. Its combination of 2,704 logic elements, approximately 113,664 bits of on-chip RAM, and up to 240 I/Os makes it suitable for designs that require consolidated logic, moderate data buffering, and significant peripheral connectivity.

For teams building commercial electronic products that need a programmable, RoHS-compliant FPGA with a flexible voltage range and standard temperature rating, this device offers an integrated option backed by Lattice Semiconductor Corporation's product support and documentation.

Request a quote or submit your procurement inquiry to receive pricing and availability information for the LFX200EB-03FH516C. Our team can assist with lead times and ordering details.