LFX200EB-04F256I

The LFX200EB-04F256I is an ispXPGA® family FPGA from Lattice Semiconductor Corporation offering a mid-density programmable logic option in a compact 256-BGA package. It provides 2,704 logic elements, approximately 0.11 Mbits of embedded memory, and support for 160 I/O pins to address diverse embedded and industrial designs.

Designed for industrial operating conditions, the device supports a 2.3 V to 3.6 V supply range and an operating temperature span of -40 °C to 105 °C. The part is supplied in a 256-FPBGA (17×17) surface-mount package and is RoHS compliant.

Key Features

• Core Logic 2,704 logic elements providing programmable logic capacity for glue logic, control functions, and moderate-complexity state machines.
• Embedded Memory Approximately 0.11 Mbits (113,664 bits) of on-chip RAM for buffering, small FIFOs, and local storage.
• I/O 160 general-purpose I/O pins for peripheral interfaces, signal aggregation, and board-level connectivity.
• Gate Capacity Specified at 210,000 gates, enabling implementation of combinational and sequential logic blocks within a single package.
• Package & Mounting 256-BGA (supplier device package: 256-FPBGA 17×17), surface-mount construction for compact board integration.
• Power Supply Broad supply range from 2.3 V to 3.6 V to match common system rails and enable flexible power design.
• Temperature & Grade Industrial grade operation from -40 °C to 105 °C for deployment in temperature-demanding environments.
• Regulatory RoHS compliant.

Typical Applications

• Industrial Control — Use the device’s industrial temperature rating and 160 I/O pins for motor control interfaces, PLC auxiliary logic, and field I/O aggregation.
• Embedded System Integration — Implement control logic, protocol bridging, and peripheral glue functions using 2,704 logic elements and on-chip RAM.
• Interface and I/O Bridging — Consolidate multiple interface signals and buffering tasks in a single 256-BGA package to save board space.
• Prototyping and Development — Rapidly prototype moderate-complexity designs that require configurable logic, on-chip RAM, and flexible I/O counts.

Unique Advantages

• Compact, high-pin-count package: The 256-FPBGA (17×17) package places 160 I/O pins and significant logic capacity into a small board footprint.
• Industrial temperature capability: Rated from -40 °C to 105 °C for deployment in temperature-challenging environments.
• Flexible power range: Operates across a 2.3 V to 3.6 V supply window to match common system rails and simplify power design.
• Balanced logic and memory: 2,704 logic elements paired with approximately 0.11 Mbits of embedded memory support a wide range of control and buffering tasks without external SRAM for many designs.
• RoHS compliant: Conforms to lead-free and restricted-substance requirements for regulatory and manufacturing consistency.

Why Choose LFX200EB-04F256I?

The LFX200EB-04F256I delivers a balanced combination of programmable logic, embedded memory, and I/O density in a compact 256-BGA package, aimed at industrial and embedded applications that require moderate logic capacity and reliable operation across a wide temperature range. Its supply voltage flexibility and RoHS compliance make it straightforward to integrate into existing system architectures.

This device is well suited for engineers designing control systems, protocol bridges, and I/O-heavy embedded platforms who need predictable, verifiable FPGA resources—logic elements, gates, RAM bits, and I/O—backed by the ispXPGA® family documentation.

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