LFX200EB-03FH516I

The LFX200EB-03FH516I is an ispXPGA® field programmable gate array (FPGA) supplied in a 256-ball BGA package. It combines a mid-range logic capacity with substantial on-chip RAM and a high I/O count to address designs that require flexible, reconfigurable logic and dense peripheral connectivity.

With 2.3 V to 3.6 V supply support and an industrial operating range of −40 °C to 105 °C, this device is targeted at industrial and embedded applications where temperature tolerance, I/O density and on-chip memory are important design considerations.

Key Features

• Logic Capacity — 2,704 logic elements providing the programmable fabric for custom digital functions and control logic.
• Embedded Memory — Approximately 0.11 Mbits (113,664 bits) of on-chip RAM for buffering, FIFOs and small data storage requirements.
• I/O Resources — 240 general-purpose I/O pins to support multi-signal interfaces, dense sensor arrays, or parallel peripheral connections.
• Gate Equivalent — Approximately 210,000 gates for estimating overall device complexity and integration density.
• Power Supply — Flexible supply range from 2.3 V to 3.6 V to accommodate common system power rails.
• Package — 256-BGA (256-FPBGA, 17 × 17) surface-mount package for compact board integration and high pin count routing.
• Industrial Temperature Range — Rated for −40 °C to 105 °C operation for use in demanding ambient conditions.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Leverage the industrial temperature rating and broad I/O count for programmable logic in factory automation, PLC extensions, and machine control interfaces.
• Sensor and Data Aggregation — Use the abundant I/O and on-chip RAM for aggregating and buffering data from multiple sensors or ADC front-ends.
• Communications and Interface Bridging — Implement protocol conversion, bus bridging or custom peripheral interfaces where numerous I/O lines and deterministic logic are required.
• Embedded System Glue Logic — Replace discrete glue components with a reconfigurable fabric to simplify BOM and consolidate control functions on a single device.

Unique Advantages

• Balanced Logic and Memory: A combination of 2,704 logic elements and approximately 0.11 Mbits of RAM enables compact implementation of control and buffering functions on a single FPGA.
• High I/O Density: 240 I/O pins provide flexibility to connect multiple peripherals, sensors, or buses without external expanders.
• Wide Supply Flexibility: Support for 2.3 V to 3.6 V supplies allows deployment across systems with varying power architectures.
• Industrial Reliability: Rated for −40 °C to 105 °C operation to meet the environmental demands of industrial and outdoor applications.
• Compact, High-Pin Package: The 256-FPBGA (17 × 17) package delivers high routing density while conserving PCB area.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing processes.

Why Choose LFX200EB-03FH516I?

The LFX200EB-03FH516I provides a practical balance of programmable logic, embedded memory and a high I/O count in a compact BGA package, designed for applications that need reconfigurable logic with industrial-grade temperature capability. Its voltage flexibility and RoHS compliance make it suitable for a range of embedded and industrial designs where board space, interfacing capacity and environmental tolerance are priorities.

This device is well suited for engineers and procurement teams looking to consolidate control, buffering and interface functions into a single FPGA to reduce component count and simplify system architectures while maintaining the ability to reprogram logic as requirements evolve.

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