LFX200EB-04F516C

The LFX200EB-04F516C is an ispXPGA® field programmable gate array from Lattice Semiconductor Corporation designed for commercial embedded applications. It provides a moderate logic density with 2,704 logic elements and on-chip RAM to implement custom digital functions, interface logic, and I/O-heavy designs in a compact 256‑BGA package.

With 240 user I/O pins, a broad supply voltage range, and RoHS compliance, this device targets commercial designs that require flexible I/O, configurable logic resources, and a compact surface-mount footprint.

Key Features

• Core Logic — 2,704 logic elements suitable for moderate-density FPGA functions and configurable digital logic implementation.
• Embedded Memory — Approximately 0.114 Mbits of on-chip RAM (113,664 bits) for data buffering, small FIFOs, and state storage.
• I/O Capacity — 240 user I/O pins to support multiple parallel interfaces, buses, and peripheral connections.
• Gate Equivalent — 210,000 gates indicating device scaling for combined combinational and sequential logic needs.
• Power — Operates from a 2.3 V to 3.6 V supply range to accommodate a variety of commercial power domains.
• Package & Mounting — 256‑BGA package (supplier package: 256‑FPBGA, 17×17) in a surface-mount form factor for space-constrained PCBs.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Commercial Embedded Systems — Implement glue logic, protocol conversion, and moderate-density custom logic where a compact BGA package and abundant I/O are needed.
• Consumer Electronics — Use the device's configurable logic and embedded RAM to manage interfaces, control subsystems, and handle on-board data buffering in commercial products.
• Interface & I/O Expansion — Leverage 240 I/Os to aggregate multiple peripheral signals, perform signal conditioning logic, or bridge between different bus standards.

Unique Advantages

• Balanced Logic and Memory: 2,704 logic elements combined with 113,664 bits of RAM provide a practical balance for designs that require both logic density and on-chip storage.
• High I/O Count: 240 user I/Os enable flexible connectivity for multi-peripheral systems and parallel interfaces, reducing the need for external glue ICs.
• Compact, Surface-Mount Package: The 256‑BGA (17×17) package minimizes PCB area while maintaining robust pin count for complex I/O requirements.
• Wide Supply Range: Support for 2.3 V to 3.6 V supplies allows integration into varied commercial power architectures.
• Regulatory Compliance: RoHS compliance supports environmental and materials requirements for commercial products.

Why Choose LFX200EB-04F516C?

The LFX200EB-04F516C positions as a commercially graded, mid-density ispXPGA® FPGA from Lattice Semiconductor Corporation, offering a balanced combination of logic elements, embedded RAM, and a high I/O count in a compact 256‑BGA package. It is suitable for designs that demand configurable logic, substantial I/O capacity, and a surface-mount footprint.

For engineers and procurement teams building commercial embedded products, this device delivers verifiable on-chip resources and a clear electrical and thermal envelope (2.3–3.6 V, 0 °C to 85 °C), enabling predictable integration into production designs.

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