LFX200EB-04FN256C

The LFX200EB-04FN256C is an ispXPGA® family FPGA from Lattice Semiconductor designed for mid-density programmable logic applications. It integrates 2,704 logic elements, 160 general-purpose I/Os and 113,664 bits of on-chip RAM to address a range of embedded and interface tasks.

Packaged in a 256-FPBGA (17 × 17) surface-mount package and specified for commercial operation (0 °C to 85 °C), the device operates from a 2.3 V to 3.6 V supply, offering a compact, board-friendly option for designs that require moderate logic capacity and substantial I/O count.

Key Features

• Core Logic 2,704 logic elements and an estimated 210,000 gates provide moderate-density programmable logic suitable for glue logic, protocol implementation and custom processing blocks.
• Embedded Memory 113,664 total RAM bits (approximately 0.11 Mbits) of on-chip memory to support FIFOs, buffering and small lookup tables.
• I/O Capacity 160 I/Os for extensive external interfacing, enabling multiple peripherals, buses and parallel connections on a single device.
• Power Supply Operates from 2.3 V to 3.6 V supply rails, providing compatibility with common platform power domains.
• Package & Mounting 256-FPBGA (17 × 17) package in a surface-mount form factor for dense PCB integration and high pin-count routing.
• Operating Range & Grade Commercial grade operation with a specified temperature range of 0 °C to 85 °C.
• Manufacturer & Family Part of the ispXPGA family from Lattice Semiconductor, offering established FPGA architecture and documentation.

Typical Applications

• Embedded System Prototyping Use the device for validating control logic, I/O aggregators and mid-complexity custom functions during development.
• Interface Bridging Implement protocol conversion and bus bridging where up to 160 I/Os and moderate logic density are required.
• Consumer and Industrial Electronics Deploy as a programmable glue-logic and peripheral controller in devices that operate within commercial temperature ranges.
• Peripheral Aggregation Consolidate multiple sensors, buttons, displays or communication endpoints using the device’s I/O complement and on-chip RAM for buffering.

Unique Advantages

• Balanced Logic and I/O Density: 2,704 logic elements combined with 160 I/Os enable consolidation of multiple discrete functions onto a single FPGA, reducing board complexity.
• On-chip RAM for Buffering: 113,664 bits of embedded memory provide local storage for FIFOs and small data structures, simplifying system-level memory requirements.
• Compact BGA Footprint: The 256-FPBGA (17 × 17) package offers a high pin-count solution in a compact surface-mount form factor for space-constrained PCBs.
• Flexible Supply Range: Operation from 2.3 V to 3.6 V allows integration with common platform voltage rails.
• Commercial Temperature Specified: Rated for 0 °C to 85 °C, suitable for consumer and commercial electronic products.

Why Choose LFX200EB-04FN256C?

The LFX200EB-04FN256C delivers a practical balance of programmable logic, ample I/O and on-chip memory in a compact 256-BGA package. Its ispXPGA® architecture and specified commercial operating range make it a suitable choice for designers needing a reliable, mid-density FPGA for interface, control and prototyping tasks.

Engineers selecting this device benefit from a clearly defined set of resources—2,704 logic elements, 160 I/Os and approximately 0.11 Mbits of embedded memory—allowing predictable system partitioning and simplified board-level integration.

Request a quote or submit a purchase inquiry to evaluate the LFX200EB-04FN256C for your next design project.