LFX200EC-03F256C

The LFX200EC-03F256C is an ispXPGA® Field Programmable Gate Array (FPGA) manufactured by Lattice Semiconductor Corporation. It delivers a compact, reprogrammable logic fabric with on-chip memory and a substantial I/O count for integration into commercial electronic designs.

Designed for surface-mount applications, this device provides a balance of logic capacity, embedded memory, and I/O resources while operating from a 2.3 V to 3.6 V supply and within a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 2,704 logic elements to implement custom combinational and sequential logic functions.
• Embedded Memory — Approximately 0.114 Mbits of on-chip RAM (113,664 total bits) for data buffering and small embedded storage.
• I/O Resources — 172 general-purpose I/O pins to support multiple external interfaces and signal connections.
• Gate Count — 210,000 gates for overall logic complexity and integration.
• Power — Operates from a 2.3 V to 3.6 V supply to accommodate common system voltage rails.
• Package & Mounting — 256-BGA package (256-FPBGA, 17×17) in a surface-mount form factor for high-density PCB integration.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Custom Logic and Prototyping — Implement and iterate application-specific logic in commercial electronic products using the device’s logic elements and reprogrammable fabric.
• I/O Expansion and Interface Bridging — Use the 172 I/O pins to connect multiple peripherals, bridge protocols, or expand system interfaces.
• Embedded Control and Glue Logic — Integrate control functions and glue logic close to processors or mixed-signal front ends within the device’s supply and temperature constraints.
• Memory Buffering — Employ the on-chip RAM for transient data storage, small FIFOs, or buffering between system elements.

Unique Advantages

• Balanced Logic and Memory: Combines 2,704 logic elements with approximately 0.114 Mbits of embedded RAM to support mid-range custom logic and buffering needs.
• High I/O Density: 172 I/O pins enable multiple peripheral connections and flexible interface mapping without external I/O expanders.
• Compact BGA Footprint: 256-BGA (17×17) package enables high-density PCB layouts while maintaining surface-mount assembly compatibility.
• Flexible Power Integration: Support for 2.3 V to 3.6 V supply rails simplifies integration with common system voltages.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for deployment in standard commercial environments.
• Regulatory Alignment: RoHS compliance supports environmental and supply-chain requirements.

Why Choose LFX200EC-03F256C?

The LFX200EC-03F256C positions itself as a compact, reprogrammable FPGA solution for commercial electronic designs that require moderate logic density, on-chip RAM, and a large number of I/Os in a BGA package. Its combination of 2,704 logic elements, approximately 0.114 Mbits of embedded memory, and 172 I/Os provides designers with the integration needed to consolidate glue logic, interface bridging, and small data buffering without adding external components.

This device is well suited to engineers and procurement teams building commercial products that demand a balance of integration, board-space efficiency, and regulatory compliance. Its support for common supply voltages, surface-mount packaging, and RoHS status help streamline system-level design and manufacturing integration.

Request a quote or submit an inquiry to check pricing, availability, and lead times for the LFX200EC-03F256C. Our team can provide further technical details and ordering information.