LFXP10C-3F256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 221184 10000 256-BGA

Quantity 1,525 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1216Number of Logic Elements/Cells10000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits221184

Overview of LFXP10C-3F256C – XP Field Programmable Gate Array (FPGA), 10,000 logic elements, 256-BGA

The LFXP10C-3F256C is a commercial-grade, non-volatile FPGA in a 256-ball fpBGA (17 × 17 mm) package optimized for compact, reconfigurable system designs. It integrates 10,000 logic elements, 221,184 bits of on-chip RAM and 188 user I/Os to support a wide range of embedded logic, memory and I/O functions.

Built on the LatticeXP family architecture, the device provides instant-on operation without external configuration memory, in-field reconfiguration capabilities and flexible voltage support (1.71 V to 3.465 V), making it suitable for space-constrained board designs that require secure, reconfigurable logic and fast startup.

Key Features

  • Core Logic Approximately 10,000 logic elements (cells) and 1,216 logic block rows/columns equivalent enabling moderate-complexity digital designs.
  • Embedded Memory 221,184 total RAM bits of on-chip memory for embedded and distributed storage of data and state.
  • I/O Flexibility 188 user I/Os in a 256-BGA package to support diverse interface requirements in a compact footprint.
  • Non-volatile, Instant-on Configuration ispXP non-volatile architecture provides instant-on power-up with no external configuration memory required, and secure configuration without an exposed bitstream.
  • In-field Reconfiguration (TransFR) TransFR™ reconfiguration enables logic updates while the system operates and supports rapid reprogramming of SRAM-based logic.
  • Low-power Modes Sleep mode capability that enables significant static current reduction for power-sensitive applications.
  • Clocking and Timing Up to four analog PLLs supporting clock multiply/divide and phase shifting for flexible timing architectures.
  • Power and Temperature Wide supply range from 1.71 V to 3.465 V and commercial operating temperature range of 0 °C to 85 °C.
  • Package and Mounting 256-ball fpBGA (17 × 17 mm) surface-mount package for high-density PCB integration; RoHS compliant.

Typical Applications

  • Embedded Control Implement custom control logic and state machines using on-chip RAM and 10,000 logic elements for compact embedded systems.
  • Prototyping and Development Leverage instant-on and in-field reconfiguration to iterate firmware-defined hardware quickly during development cycles.
  • Interface Bridging Use the device’s 188 I/Os to aggregate, translate or buffer signals between different subsystems on a single board.
  • Secure, Boot-Critical Logic Non-volatile configuration with no external configuration memory reduces the attack surface for configuration security and enables fast system startup.

Unique Advantages

  • Instant-on non-volatile configuration: Eliminates the need for external configuration memory and reduces system boot time.
  • Reconfigurable in-field: TransFR reconfiguration allows targeted logic updates while the system remains operational, reducing downtime for updates.
  • Balanced integration: A combination of 10,000 logic elements, 221,184 bits of RAM and 188 I/Os in a 256-BGA package simplifies board-level integration and reduces BOM complexity.
  • Power management flexibility: Sleep mode supports significant static current reduction for energy-conscious designs.
  • Flexible supply support: Operates across a broad supply range (1.71 V to 3.465 V) to accommodate mixed-voltage system designs.
  • Design ecosystem support: Family-level design flow and pre-designed IP packages referenced in the LatticeXP data enable efficient use of available design tools and IP.

Why Choose LFXP10C-3F256C?

The LFXP10C-3F256C positions itself as a compact, secure and instantly available FPGA solution for commercial embedded systems that need moderate logic capacity, flexible I/O and on-chip memory without the overhead of external configuration devices. Its non-volatile architecture and in-field reconfiguration capabilities let teams minimize boot time and update logic in deployed systems.

This device is well suited for designers seeking a balance of integration, startup performance and reconfigurability—backed by the LatticeXP family features and associated design tool support referenced in the product documentation.

Request a quote or submit an inquiry to obtain pricing, lead time and availability for LFXP10C-3F256C. Include your quantity and any required delivery details to help expedite the response.

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