LFXP10C-3F256C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 221184 10000 256-BGA |
|---|---|
| Quantity | 1,525 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1216 | Number of Logic Elements/Cells | 10000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 221184 |
Overview of LFXP10C-3F256C – XP Field Programmable Gate Array (FPGA), 10,000 logic elements, 256-BGA
The LFXP10C-3F256C is a commercial-grade, non-volatile FPGA in a 256-ball fpBGA (17 × 17 mm) package optimized for compact, reconfigurable system designs. It integrates 10,000 logic elements, 221,184 bits of on-chip RAM and 188 user I/Os to support a wide range of embedded logic, memory and I/O functions.
Built on the LatticeXP family architecture, the device provides instant-on operation without external configuration memory, in-field reconfiguration capabilities and flexible voltage support (1.71 V to 3.465 V), making it suitable for space-constrained board designs that require secure, reconfigurable logic and fast startup.
Key Features
- Core Logic Approximately 10,000 logic elements (cells) and 1,216 logic block rows/columns equivalent enabling moderate-complexity digital designs.
- Embedded Memory 221,184 total RAM bits of on-chip memory for embedded and distributed storage of data and state.
- I/O Flexibility 188 user I/Os in a 256-BGA package to support diverse interface requirements in a compact footprint.
- Non-volatile, Instant-on Configuration ispXP non-volatile architecture provides instant-on power-up with no external configuration memory required, and secure configuration without an exposed bitstream.
- In-field Reconfiguration (TransFR) TransFR™ reconfiguration enables logic updates while the system operates and supports rapid reprogramming of SRAM-based logic.
- Low-power Modes Sleep mode capability that enables significant static current reduction for power-sensitive applications.
- Clocking and Timing Up to four analog PLLs supporting clock multiply/divide and phase shifting for flexible timing architectures.
- Power and Temperature Wide supply range from 1.71 V to 3.465 V and commercial operating temperature range of 0 °C to 85 °C.
- Package and Mounting 256-ball fpBGA (17 × 17 mm) surface-mount package for high-density PCB integration; RoHS compliant.
Typical Applications
- Embedded Control Implement custom control logic and state machines using on-chip RAM and 10,000 logic elements for compact embedded systems.
- Prototyping and Development Leverage instant-on and in-field reconfiguration to iterate firmware-defined hardware quickly during development cycles.
- Interface Bridging Use the device’s 188 I/Os to aggregate, translate or buffer signals between different subsystems on a single board.
- Secure, Boot-Critical Logic Non-volatile configuration with no external configuration memory reduces the attack surface for configuration security and enables fast system startup.
Unique Advantages
- Instant-on non-volatile configuration: Eliminates the need for external configuration memory and reduces system boot time.
- Reconfigurable in-field: TransFR reconfiguration allows targeted logic updates while the system remains operational, reducing downtime for updates.
- Balanced integration: A combination of 10,000 logic elements, 221,184 bits of RAM and 188 I/Os in a 256-BGA package simplifies board-level integration and reduces BOM complexity.
- Power management flexibility: Sleep mode supports significant static current reduction for energy-conscious designs.
- Flexible supply support: Operates across a broad supply range (1.71 V to 3.465 V) to accommodate mixed-voltage system designs.
- Design ecosystem support: Family-level design flow and pre-designed IP packages referenced in the LatticeXP data enable efficient use of available design tools and IP.
Why Choose LFXP10C-3F256C?
The LFXP10C-3F256C positions itself as a compact, secure and instantly available FPGA solution for commercial embedded systems that need moderate logic capacity, flexible I/O and on-chip memory without the overhead of external configuration devices. Its non-volatile architecture and in-field reconfiguration capabilities let teams minimize boot time and update logic in deployed systems.
This device is well suited for designers seeking a balance of integration, startup performance and reconfigurability—backed by the LatticeXP family features and associated design tool support referenced in the product documentation.
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