LFXP10C-3F388I

IC FPGA 244 I/O 388FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA

Quantity 290 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package388-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case388-BBGANumber of I/O244Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1216Number of Logic Elements/Cells10000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits221184

Overview of LFXP10C-3F388I – XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA

The LFXP10C-3F388I is a non-volatile FPGA from Lattice Semiconductor’s LatticeXP family, providing a reconfigurable logic fabric with on-chip memory and flexible I/O in a 388-ball FPBGA package (23 × 23 mm). Targeted for industrial-grade system designs, it combines instant-on operation, in-field reconfiguration capability and a broad voltage and temperature operating range to support embedded and system-level applications.

Key Features

  • Non-volatile, infinitely reconfigurable – Instant-on operation (powers up in microseconds) with no external configuration memory required and support for reconfiguration through system configuration and JTAG ports.
  • Logic density – Approximately 10,000 logic elements to implement medium-complexity designs.
  • On-chip memory – Approximately 221 Kbits of embedded RAM for distributed and block memory usage.
  • I/O capacity and package – 244 user I/Os in a 388-ball FPBGA (388-BBGA) 23 × 23 mm supplier package.
  • Voltage and temperature – Operates from 1.71 V to 3.465 V and across an industrial temperature range of −40 °C to 100 °C.
  • Low-power and power management – Sleep mode enables up to 1000× static current reduction for low-power standby operation.
  • In-field updates – TransFR™ Reconfiguration (TFR) allows in-field logic updates while the system operates.
  • Flexible I/O support – Programmable sysIO™ buffer supports a wide range of interfaces including LVCMOS (1.2–3.3 V), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
  • Clocking and memory interfaces – Up to four analog PLLs per device and dedicated DDR memory support (interface up to DDR333).
  • System-level features – IEEE 1149.1 boundary scan and onboard instrumentation features such as ispTRACY internal logic analyzer and an onboard oscillator for configuration.

Typical Applications

  • Embedded system control – Use the reconfigurable logic and on-chip memory to implement control logic, glue logic and protocol adaptation in embedded products.
  • Industrial automation – Industrial temperature rating and flexible I/O options make the device suitable for sensor interfacing, motor control logic and factory automation subsystems.
  • Memory interface and buffering – Dedicated DDR support and multiple PLLs enable implementation of memory controllers and timing-critical interface logic.
  • Communications and I/O bridging – High I/O count and programmable I/O buffers allow protocol bridging and custom interface implementations.

Unique Advantages

  • Instant-on, no external config memory: Non-volatile architecture eliminates the need for external configuration memory and provides microsecond power-up.
  • Field-updatable: TransFR reconfiguration allows in-field logic updates without taking the system offline, reducing maintenance windows.
  • Broad I/O flexibility: Wide-ranging programmable I/O standards simplify integration with legacy and modern interfaces from single device silicon.
  • Power-efficient standby: Sleep mode delivers significant static current reduction for low-power system designs.
  • Industrial operating range: Specified for −40 °C to 100 °C, supporting deployment in industrial environments.
  • Integrated system features: Onboard oscillator, boundary-scan support and internal logic analyzer capability aid bring-up, test and debug.

Why Choose LFXP10C-3F388I?

The LFXP10C-3F388I delivers a balanced combination of reconfigurable logic density, on-chip memory and a high I/O count in a compact 388-ball package, designed for industrial-grade system applications. Its non-volatile, instant-on architecture and in-field reconfiguration capabilities make it well-suited to designs that require secure configuration, rapid start-up and maintainability in the field.

With flexible voltage support, multiple PLLs, dedicated DDR interface capability and comprehensive I/O standard support, this device is positioned for embedded designers and system integrators who need a versatile FPGA platform that simplifies BOM and accelerates development while supporting long-term scalability.

Request a quote or submit a pricing inquiry to evaluate LFXP10C-3F388I for your next design and get assistance with availability and lead times.

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