LFXP10C-3F388I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA |
|---|---|
| Quantity | 290 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 388-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 388-BBGA | Number of I/O | 244 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1216 | Number of Logic Elements/Cells | 10000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 221184 |
Overview of LFXP10C-3F388I – XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA
The LFXP10C-3F388I is a non-volatile FPGA from Lattice Semiconductor’s LatticeXP family, providing a reconfigurable logic fabric with on-chip memory and flexible I/O in a 388-ball FPBGA package (23 × 23 mm). Targeted for industrial-grade system designs, it combines instant-on operation, in-field reconfiguration capability and a broad voltage and temperature operating range to support embedded and system-level applications.
Key Features
- Non-volatile, infinitely reconfigurable – Instant-on operation (powers up in microseconds) with no external configuration memory required and support for reconfiguration through system configuration and JTAG ports.
- Logic density – Approximately 10,000 logic elements to implement medium-complexity designs.
- On-chip memory – Approximately 221 Kbits of embedded RAM for distributed and block memory usage.
- I/O capacity and package – 244 user I/Os in a 388-ball FPBGA (388-BBGA) 23 × 23 mm supplier package.
- Voltage and temperature – Operates from 1.71 V to 3.465 V and across an industrial temperature range of −40 °C to 100 °C.
- Low-power and power management – Sleep mode enables up to 1000× static current reduction for low-power standby operation.
- In-field updates – TransFR™ Reconfiguration (TFR) allows in-field logic updates while the system operates.
- Flexible I/O support – Programmable sysIO™ buffer supports a wide range of interfaces including LVCMOS (1.2–3.3 V), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
- Clocking and memory interfaces – Up to four analog PLLs per device and dedicated DDR memory support (interface up to DDR333).
- System-level features – IEEE 1149.1 boundary scan and onboard instrumentation features such as ispTRACY internal logic analyzer and an onboard oscillator for configuration.
Typical Applications
- Embedded system control – Use the reconfigurable logic and on-chip memory to implement control logic, glue logic and protocol adaptation in embedded products.
- Industrial automation – Industrial temperature rating and flexible I/O options make the device suitable for sensor interfacing, motor control logic and factory automation subsystems.
- Memory interface and buffering – Dedicated DDR support and multiple PLLs enable implementation of memory controllers and timing-critical interface logic.
- Communications and I/O bridging – High I/O count and programmable I/O buffers allow protocol bridging and custom interface implementations.
Unique Advantages
- Instant-on, no external config memory: Non-volatile architecture eliminates the need for external configuration memory and provides microsecond power-up.
- Field-updatable: TransFR reconfiguration allows in-field logic updates without taking the system offline, reducing maintenance windows.
- Broad I/O flexibility: Wide-ranging programmable I/O standards simplify integration with legacy and modern interfaces from single device silicon.
- Power-efficient standby: Sleep mode delivers significant static current reduction for low-power system designs.
- Industrial operating range: Specified for −40 °C to 100 °C, supporting deployment in industrial environments.
- Integrated system features: Onboard oscillator, boundary-scan support and internal logic analyzer capability aid bring-up, test and debug.
Why Choose LFXP10C-3F388I?
The LFXP10C-3F388I delivers a balanced combination of reconfigurable logic density, on-chip memory and a high I/O count in a compact 388-ball package, designed for industrial-grade system applications. Its non-volatile, instant-on architecture and in-field reconfiguration capabilities make it well-suited to designs that require secure configuration, rapid start-up and maintainability in the field.
With flexible voltage support, multiple PLLs, dedicated DDR interface capability and comprehensive I/O standard support, this device is positioned for embedded designers and system integrators who need a versatile FPGA platform that simplifies BOM and accelerates development while supporting long-term scalability.
Request a quote or submit a pricing inquiry to evaluate LFXP10C-3F388I for your next design and get assistance with availability and lead times.

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