LFXP10C-3F388C

IC FPGA 244 I/O 388FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA

Quantity 366 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package388-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case388-BBGANumber of I/O244Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1216Number of Logic Elements/Cells10000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits221184

Overview of LFXP10C-3F388C – XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA

The LFXP10C-3F388C is a non-volatile LatticeXP family FPGA from Lattice Semiconductor Corporation, integrating a dense logic fabric, on-chip memory and a high‑pin‑count I/O array in a 388-ball fpBGA package. It targets system designs that require instant-on operation, in-field reconfiguration and flexible I/O support.

This device combines 1,216 logic blocks with 10,000 logic elements and approximately 0.22 Mbits of embedded RAM, delivering a compact, reconfigurable building block for embedded control, interface bridging and mid-density FPGA applications.

Key Features

  • Core Logic — 1,216 logic blocks and 10,000 logic elements for mid-range logic integration and custom digital processing.
  • Embedded Memory — Total on-chip RAM of 221,184 bits (approximately 0.22 Mbits) for distributed and block memory use in code, buffering and state storage.
  • I/O Capacity & Flexibility — 244 user I/Os in the 388-ball fpBGA package to support a broad mix of peripheral and bus interfaces.
  • Non-volatile, Instant-on Architecture — LatticeXP family non-volatile technology provides instant-on behavior and eliminates the need for external configuration memory.
  • In-field Reconfiguration — Supports TransFR™ reconfiguration for in-field logic updates while the system remains operational.
  • Clocking — Up to 4 analog PLLs per device for clock multiplication, division and phase shifting to support diverse timing domains.
  • Memory Interface Support — Dedicated DDR memory support up to DDR333 (as defined by the LatticeXP family capabilities).
  • Power and Supply — Operates over a supply voltage range of 1.71 V to 3.465 V to accommodate multiple system rails.
  • Package & Mounting — 388-ball fpBGA (23 × 23 mm) package, surface-mountable for compact board-level integration.
  • Commercial Grade Temperature — Rated for 0 °C to 85 °C operation.
  • Standards & Tools — Family-level support includes IEEE 1149.1 boundary scan and JTAG configuration; design tool ecosystem supports synthesis and IP reuse (LatticeXP family features).
  • Environmental — RoHS compliant.

Typical Applications

  • Interface Bridging — Implement protocol conversion and custom interface logic using abundant I/O and flexible clocking.
  • Embedded Control — Use the device for mid-density control tasks, combining logic, local RAM and PLLs for deterministic timing and state handling.
  • In-Field Upgradable Systems — Deploy designs that require live updates or feature upgrades through TransFR™ reconfiguration capabilities.
  • Memory Controller and Buffering — Leverage on-chip RAM and DDR support for buffering, memory interfacing and data-path acceleration.

Unique Advantages

  • Instant-on, non-volatile configuration: Eliminates the need for external configuration memory and enables rapid power-up behavior for time-sensitive systems.
  • In-field logic updates: TransFR™ reconfiguration permits updates to deployed designs without full system downtime.
  • Balanced integration: Combines mid-level logic capacity with substantial I/O and embedded RAM to reduce external components and simplify board design.
  • Flexible clocking: Up to four PLLs allow designers to generate multiple clock domains and perform phase adjustments on-chip.
  • Wide supply compatibility: Support for a broad supply voltage range enables operation from different system rails and simplifies power‑tree design.
  • Compact, high-density package: 388-ball fpBGA (23 × 23 mm) offers high I/O density in a surface-mount footprint suitable for space-constrained PCBs.

Why Choose LFXP10C-3F388C?

The LFXP10C-3F388C positions itself as a versatile mid-density FPGA that combines instant-on, non-volatile operation with the capacity needed for interface-heavy and embedded control applications. Its mix of 10,000 logic elements, approximately 0.22 Mbits of embedded memory, 244 I/Os and up to four PLLs makes it well suited for designs that require in-field update capability and robust I/O connectivity.

Designed for commercial temperature environments and RoHS-compliant production, this device is a practical choice for engineers seeking a compact, reconfigurable solution backed by the LatticeXP family architecture and ecosystem.

Request a quote or submit a pricing request for LFXP10C-3F388C to start integrating this FPGA into your next design.

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