LFXP10C-3F388C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA |
|---|---|
| Quantity | 366 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 388-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 388-BBGA | Number of I/O | 244 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1216 | Number of Logic Elements/Cells | 10000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 221184 |
Overview of LFXP10C-3F388C – XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA
The LFXP10C-3F388C is a non-volatile LatticeXP family FPGA from Lattice Semiconductor Corporation, integrating a dense logic fabric, on-chip memory and a high‑pin‑count I/O array in a 388-ball fpBGA package. It targets system designs that require instant-on operation, in-field reconfiguration and flexible I/O support.
This device combines 1,216 logic blocks with 10,000 logic elements and approximately 0.22 Mbits of embedded RAM, delivering a compact, reconfigurable building block for embedded control, interface bridging and mid-density FPGA applications.
Key Features
- Core Logic — 1,216 logic blocks and 10,000 logic elements for mid-range logic integration and custom digital processing.
- Embedded Memory — Total on-chip RAM of 221,184 bits (approximately 0.22 Mbits) for distributed and block memory use in code, buffering and state storage.
- I/O Capacity & Flexibility — 244 user I/Os in the 388-ball fpBGA package to support a broad mix of peripheral and bus interfaces.
- Non-volatile, Instant-on Architecture — LatticeXP family non-volatile technology provides instant-on behavior and eliminates the need for external configuration memory.
- In-field Reconfiguration — Supports TransFR™ reconfiguration for in-field logic updates while the system remains operational.
- Clocking — Up to 4 analog PLLs per device for clock multiplication, division and phase shifting to support diverse timing domains.
- Memory Interface Support — Dedicated DDR memory support up to DDR333 (as defined by the LatticeXP family capabilities).
- Power and Supply — Operates over a supply voltage range of 1.71 V to 3.465 V to accommodate multiple system rails.
- Package & Mounting — 388-ball fpBGA (23 × 23 mm) package, surface-mountable for compact board-level integration.
- Commercial Grade Temperature — Rated for 0 °C to 85 °C operation.
- Standards & Tools — Family-level support includes IEEE 1149.1 boundary scan and JTAG configuration; design tool ecosystem supports synthesis and IP reuse (LatticeXP family features).
- Environmental — RoHS compliant.
Typical Applications
- Interface Bridging — Implement protocol conversion and custom interface logic using abundant I/O and flexible clocking.
- Embedded Control — Use the device for mid-density control tasks, combining logic, local RAM and PLLs for deterministic timing and state handling.
- In-Field Upgradable Systems — Deploy designs that require live updates or feature upgrades through TransFR™ reconfiguration capabilities.
- Memory Controller and Buffering — Leverage on-chip RAM and DDR support for buffering, memory interfacing and data-path acceleration.
Unique Advantages
- Instant-on, non-volatile configuration: Eliminates the need for external configuration memory and enables rapid power-up behavior for time-sensitive systems.
- In-field logic updates: TransFR™ reconfiguration permits updates to deployed designs without full system downtime.
- Balanced integration: Combines mid-level logic capacity with substantial I/O and embedded RAM to reduce external components and simplify board design.
- Flexible clocking: Up to four PLLs allow designers to generate multiple clock domains and perform phase adjustments on-chip.
- Wide supply compatibility: Support for a broad supply voltage range enables operation from different system rails and simplifies power‑tree design.
- Compact, high-density package: 388-ball fpBGA (23 × 23 mm) offers high I/O density in a surface-mount footprint suitable for space-constrained PCBs.
Why Choose LFXP10C-3F388C?
The LFXP10C-3F388C positions itself as a versatile mid-density FPGA that combines instant-on, non-volatile operation with the capacity needed for interface-heavy and embedded control applications. Its mix of 10,000 logic elements, approximately 0.22 Mbits of embedded memory, 244 I/Os and up to four PLLs makes it well suited for designs that require in-field update capability and robust I/O connectivity.
Designed for commercial temperature environments and RoHS-compliant production, this device is a practical choice for engineers seeking a compact, reconfigurable solution backed by the LatticeXP family architecture and ecosystem.
Request a quote or submit a pricing request for LFXP10C-3F388C to start integrating this FPGA into your next design.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016