LFX200EB-05FN256C

The LFX200EB-05FN256C is an ispXPGA® family FPGA offering a compact, surface-mount solution for designs that require moderate programmable logic and a high I/O count. It provides 2,704 logic elements, approximately 0.114 Mbits of embedded RAM, and 160 I/Os in a 256‑BGA (256‑FPBGA 17×17) package.

Per the ispXPGA device datasheet, this device is listed as active and orderable. Its specification set — including supply range and commercial operating temperature — suits a wide range of commercial embedded applications where deterministic, reconfigurable logic is needed.

Key Features

• Core Logic  2,704 logic elements and approximately 210,000 equivalent gates provide the programmable resources for custom digital functions.
• Embedded Memory  Approximately 113,664 bits (≈0.114 Mbit) of on-chip RAM to support small buffers, state machines, and local data storage.
• I/O Capacity  160 user I/Os for flexible interfacing to peripherals, sensors, and other system I/O needs.
• Package & Mounting  256‑BGA (256‑FPBGA, 17×17) surface-mount package for compact board layouts and reliable soldered connections.
• Power  Supports a supply voltage range of 2.3 V to 3.6 V, enabling compatibility with common commercial power rails.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for standard embedded and commercial applications.
• Compliance & Availability  RoHS compliant; device listed as active/orderable in the ispXPGA family documentation.

Typical Applications

• Custom Logic and Prototyping  Implement control logic, glue logic, and proof-of-concept designs using 2,704 logic elements and on-chip RAM.
• I/O Bridging and Interface Control  Use the 160 I/Os to connect and translate between multiple peripherals or external interfaces on compact PCBs.
• Local Data Buffering & State Machines  Leverage approximately 113,664 bits of embedded RAM for small buffers, FIFOs, and finite-state controllers.

Unique Advantages

• Balanced Logic Capacity: 2,704 logic elements and ~210,000 gates provide a practical blend of programmable resources for mid-range FPGA tasks without excessive area.
• High I/O Count: 160 I/Os enable flexible system integration and simplify board-level routing when interfacing multiple peripherals.
• Compact BGA Package: 256‑FPBGA (17×17) minimizes board footprint while supporting robust surface-mount assembly.
• Wide Supply Compatibility: 2.3 V to 3.6 V supply range supports common commercial power domains for easier system power design.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to meet the needs of mainstream embedded and commercial products.
• Regulatory Compliance: RoHS compliance helps meet environmental and manufacturing requirements for commercial assemblies.

Why Choose LFX200EB-05FN256C?

The LFX200EB-05FN256C delivers a practical combination of logic density, embedded RAM, and a high I/O count in a compact 256‑BGA footprint. As part of the ispXPGA family and listed as active/orderable in the device datasheet, it is a suitable choice for designers seeking reconfigurable logic for commercial embedded systems that require moderate complexity and flexible interfacing.

Its supply range, commercial temperature rating, and RoHS compliance make it straightforward to integrate into standard production environments while providing the on-chip resources needed for buffering, control logic, and interface glue functions.

Request a quote or submit an inquiry for pricing and availability of the LFX200EB-05FN256C to support your next embedded design.