LFX200EB-03FN256I

The LFX200EB-03FN256I is an ispXPGA® Field Programmable Gate Array (FPGA) supplied in a 256-ball BGA package. It provides a compact, reprogrammable logic fabric with a substantial I/O count and on-chip RAM for custom digital logic and interface functions.

Designed for industrial-grade applications, the device supports a wide supply range and extended operating temperature, making it suitable for deployed systems that require programmable logic with up to 160 user I/Os.

Key Features

• Logic Capacity  Approximately 2,704 logic elements for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 0.11 Mbits of embedded memory (113,664 total RAM bits) to support FIFOs, small buffers and state storage.
• I/O  Up to 160 user I/Os enabling broad interface support and signal consolidation on a single device.
• Gate Count  Approximately 210,000 gates for expressing moderate-complexity logic and glue functions.
• Power  Flexible supply range from 2.3 V to 3.6 V to accommodate a variety of board power architectures.
• Package & Mounting  256-ball FBGA (17 × 17 mm) surface-mount package (256-BGA / 256-FPBGA), suitable for compact PCB layouts.
• Temperature & Grade  Industrial grade with an operating temperature from −40 °C to 105 °C for reliable operation in demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Custom state machines, protocol handling and I/O aggregation in systems that require operation from −40 °C to 105 °C.
• Embedded Interface Logic  Implementing bridge logic, protocol conversion and signal conditioning for designs needing up to 160 I/Os.
• Prototyping and Custom Acceleration  Rapid implementation of moderate-complexity algorithms and glue logic using the device’s 2,704 logic elements and on-chip RAM.

Unique Advantages

• Balanced Logic and Memory:  Combination of ~2,704 logic elements and ~0.11 Mbits of embedded RAM supports a wide range of custom logic and buffering needs without external memory.
• High I/O Density:  160 available I/Os let you consolidate multiple peripheral interfaces or sensor connections onto a single FPGA, reducing PCB complexity.
• Flexible Power Options:  2.3 V–3.6 V supply range enables integration into diverse power architectures and simplifies board-level power design.
• Industrial Temperature Range:  Rated for −40 °C to 105 °C operation to meet the environmental demands of industrial deployments.
• Compact BGA Package:  256-FPBGA (17 × 17 mm) provides high pin count in a small footprint for space-constrained designs.
• Regulatory Compliance:  RoHS compliance supports use in environmentally regulated products.

Why Choose LFX200EB-03FN256I?

The LFX200EB-03FN256I positions itself as a practical FPGA option for industrial and embedded designs that need balanced logic capacity, on-chip memory, and a high I/O count in a compact BGA package. Its broad supply range and extended temperature rating make it suitable for deployed systems with moderate complexity and demanding environmental requirements.

This device is well suited to engineers looking to consolidate interface logic, implement custom control functions, or prototype moderate-scale logic designs while keeping board area and BOM count under control.

Request a quote or submit an inquiry to receive pricing and availability information for the LFX200EB-03FN256I.