LFX200B-04FN256C

The LFX200B-04FN256C is an ispXPGA® family Field Programmable Gate Array (FPGA) offered in a 256-ball BGA package. It provides a balance of programmable logic, embedded RAM, and general-purpose I/O for commercial-grade digital designs.

The device is listed as Active / Orderable in the ispXPGA family datasheet and targets applications that require on-chip programmable logic with compact packaging and standard commercial temperature operation.

Key Features

• Logic Capacity — 2,704 logic elements (cells) organized across 676 CLBs, enabling implementation of custom digital functions and combinational/sequential logic.
• Embedded Memory — Approximately 0.114 Mbits (113,664 bits) of on-chip RAM for buffers, FIFOs, and small on-chip data storage.
• I/O — 160 general-purpose I/O pins to support multiple interfaces and board-level connectivity requirements.
• Gates — An estimated 210,000 equivalent gates for sizing and system partitioning considerations.
• Power and Supply — Operates from a 2.3 V to 3.6 V supply range to support typical commercial power domains.
• Package and Mounting — 256-BGA (supplier package: 256-FPBGA, 17×17) in a surface-mount format for compact PCB layouts.
• Temperature and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS-compliant construction for environmental regulation alignment.

Typical Applications

• Custom digital logic and prototyping — Implement and iterate user-defined logic, state machines, and glue logic in a programmable device.
• I/O consolidation — Aggregate and manage multiple parallel or serial interfaces using the device’s 160 I/O pins.
• Embedded buffering and small-memory tasks — Use on-chip RAM for data buffering, small FIFOs, or temporary storage close to logic.

Unique Advantages

• Balanced logic and memory — 2,704 logic elements combined with ~0.114 Mbits of embedded RAM supports mixed control and data-path implementations without relying entirely on external memory.
• Generous I/O count — 160 I/O pins provide flexibility for connecting peripheral devices, sensors, or board-level interfaces, reducing the need for additional interface chips.
• Compact BGA footprint — 256-BGA (17×17 FPBGA) enables a high-density, space-efficient PCB layout suitable for constrained assemblies.
• Wide supply tolerance — 2.3 V to 3.6 V supply range accommodates common commercial power rails and design variants.
• Commercial temperature rating — Specified 0 °C to 85 °C operation aligns with a broad range of general-purpose electronic products.
• RoHS compliant — Built to meet RoHS requirements for regulated product lines.

Why Choose LFX200B-04FN256C?

The LFX200B-04FN256C delivers a practical combination of programmable logic, embedded RAM, and a high I/O count in a compact 256-BGA package, suited to commercial designs that require on-chip customization and interface flexibility. Its supply voltage range and commercial temperature rating make it appropriate for a wide range of board-level implementations.

This ispXPGA® device is positioned for engineers and procurement teams seeking an active, orderable FPGA option within the Lattice ispXPGA family, offering straightforward integration into existing power and PCB constraints while providing the reprogrammability advantages of FPGA technology.

If you would like pricing, availability, or to request a quote for the LFX200B-04FN256C, please submit an inquiry or request a quote through your preferred purchasing channel.