LFX125EC-03F256C

The LFX125EC-03F256C is an ispXPGA® field programmable gate array from Lattice Semiconductor Corporation, offered in a 256-ball BGA package. It provides a mid-range programmable fabric with 1,936 logic elements and 94,208 bits of on-chip RAM for implementing custom digital logic.

This commercial-grade FPGA supports 94 I/O signals and operates from a 2.3 V to 3.6 V supply, making it suitable for consumer and communications designs, rapid prototyping, and general-purpose embedded logic functions within a 0 °C to 85 °C operating range.

Key Features

• Core Logic  Contains 1,936 logic elements and approximately 139,000 gates to implement combinational and sequential logic.
• Embedded Memory  Includes 94,208 bits of total on-chip RAM to support FIFOs, small buffers, and state storage.
• I/O Capacity  Provides 94 general-purpose I/O pins for interfacing with peripherals, sensors, and external devices.
• Power  Operates from a 2.3 V to 3.6 V supply range to match common system power rails.
• Package & Mounting  Supplied in a 256-ball FPBGA (17 × 17 mm) package for surface-mount PCB assembly.
• Operating Conditions  Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• Consumer Electronics  Used for custom logic, glue-logic, and peripheral bridging in products where moderate logic density and multiple I/Os are required.
• Communications Equipment  Suitable for protocol adaptation, data formatting, and control-plane logic leveraging available I/O and embedded RAM.
• Prototyping & Development  Well-suited for embedded system prototyping and proof-of-concept designs that need reprogrammable logic and quick iteration.
• Instrumentation & Test  Useful for custom signal routing, timing control, and small-scale data buffering in bench instruments and test fixtures.

Unique Advantages

• Balanced Logic and Memory:  1,936 logic elements combined with 94,208 bits of RAM support a range of mid-scale logic functions without external memory.
• Flexible I/O Count:  94 available I/Os simplify direct interfacing to multiple peripherals and sensors, reducing the need for I/O expanders.
• Compact Packaging:  256-FPBGA (17 × 17 mm) package delivers a high pin count in a compact, surface-mount footprint suitable for space-constrained boards.
• Standard Power Range:  2.3 V to 3.6 V supply compatibility aligns with common system power rails for straightforward integration.
• Commercial Readiness:  Designed for commercial applications with RoHS compliance and a 0 °C to 85 °C operating range for typical deployment environments.

Why Choose LFX125EC-03F256C?

The LFX125EC-03F256C positions itself as a practical, mid-range ispXPGA® FPGA for designers who need a balance of logic density, on-chip RAM, and I/O capacity in a compact BGA package. Its combination of 1,936 logic elements, 94,208 bits of RAM, and 94 I/Os makes it well suited to consumer, communications, prototyping, and instrumentation projects that require reprogrammable digital logic without external memory.

Choose this device when your design requires a commercial-grade, surface-mount FPGA with standard supply voltage support and a defined operating temperature range—providing a clear, verifiable specification set for procurement and system integration.

Request a quote or contact sales to discuss pricing, availability, and how the LFX125EC-03F256C can fit into your next design.