LFX125EB-04FN256I

The LFX125EB-04FN256I is an ispXPGA® field programmable gate array (FPGA) in a 256-ball BGA package, designed for medium-density programmable logic tasks. It provides 1,936 logic elements and on-chip embedded memory (94,208 bits) combined with up to 160 I/Os, delivering flexible integration for industrial embedded designs.

With an operating voltage range of 2.3 V to 3.6 V and an industrial operating temperature range of −40 °C to 105 °C, this device targets applications that require reliable programmable logic and broad environmental tolerance while maintaining a compact surface-mount footprint.

Key Features

• Core Logic  Provides 1,936 logic elements for implementing custom combinational and sequential logic functions within the ispXPGA® architecture.
• Embedded Memory  Approximately 94,208 bits of on-chip RAM to support local data buffering, small FIFOs, and state storage.
• I/O Density  Up to 160 user I/Os, enabling broad peripheral and sensor connectivity without excessive external glue logic.
• Gate Count  Approximately 139,000 gates of device capability to accommodate medium-complexity logic designs.
• Power Supply  Supports a wide supply range from 2.3 V to 3.6 V for compatibility with common system rails.
• Package & Mounting  256-ball FPBGA (17 × 17 mm) surface-mount package suited for compact PCB layouts and automated assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 105 °C to meet demanding environmental conditions.
• Regulatory Compliance  RoHS compliant for compatibility with modern environmental requirements.

Typical Applications

• Industrial Control  Leverage industrial temperature rating and 160 I/Os for sensor interfacing, I/O expansion, and control logic in industrial equipment.
• Embedded Systems  Use the 1,936 logic elements and on-chip RAM for custom peripheral glue logic, state machines, and protocol adaptation in embedded products.
• Interface Bridging  Implement custom interface converters or bus bridges where medium-density programmable logic and a high I/O count are required.

Unique Advantages

• Balanced Logic and Memory: 1,936 logic elements paired with ~94,208 bits of RAM provide a practical balance for medium-complexity designs that need local buffering and control logic.
• High I/O Count: 160 I/Os allow direct connections to a wide range of peripherals and sensors, reducing the need for additional interface chips.
• Wide Supply Flexibility: Operation across 2.3 V to 3.6 V supports integration with multiple system power architectures.
• Industrial Temperature Capability: Rated from −40 °C to 105 °C for reliable deployment in temperature-challenging environments.
• Compact, Assembly-Ready Package: 256-FPBGA (17 × 17 mm) surface-mount package is optimized for space-constrained PCBs and volume assembly processes.
• RoHS Compliant: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose LFX125EB-04FN256I?

The LFX125EB-04FN256I offers a practical combination of logic resources, on-chip RAM, and high I/O density in the ispXPGA® family form factor, making it well suited for designers who need medium-density programmable logic with industrial-grade environmental tolerance. Its broad supply voltage range and compact 256-BGA package simplify integration into embedded systems where board space and environmental robustness matter.

This device is appropriate for development teams and product engineers building industrial controls, embedded interfaces, or I/O-intensive subsystems that require stable operation across a wide temperature range and compliance with RoHS directives.

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