LFX125EB-04F256I

The LFX125EB-04F256I is an ispXPGA® family FPGA from Lattice Semiconductor designed for industrial-grade embedded logic. It provides 1,936 logic elements and approximately 94,208 bits of on-chip RAM in a compact 256-FPBGA (17×17) package, delivering a balance of logic capacity, I/O density and memory for mid-density programmable designs.

This device operates from a 2.3 V to 3.6 V supply, supports up to 160 I/O pins and is specified for operation from −40 °C to 105 °C. It is RoHS compliant and supplied in a surface-mount BGA package suitable for production PCB assembly.

Key Features

• Core Logic
  Contains 1,936 logic elements and an internal design mapped to approximately 139,000 gates, enabling a variety of combinational and sequential logic implementations.
• Embedded Memory
  Includes 94,208 bits of on-chip RAM (approximately 0.094 Mbits) for registers, FIFOs and small data buffers directly within the device fabric.
• I/O Density
  Offers 160 user I/O pins to interface with external peripherals, sensors, and controllers.
• Package & Mounting
  Supplied in a 256-FPBGA (17×17) package; designed for surface-mount assembly to minimize board area.
• Power
  Operates from a wide 2.3 V to 3.6 V supply range to support common system rails.
• Environmental & Reliability
  Industrial-grade device rated for operation from −40 °C to 105 °C and RoHS compliant for environmental and regulatory alignment.

Unique Advantages

• Balanced Logic and Memory: 1,936 logic elements combined with 94,208 bits of RAM allow integrated handling of control logic and modest on-chip data storage without external memories.
• High I/O Count: 160 I/O pins provide flexibility for interfacing multiple peripherals and signals in compact designs.
• Compact BGA Package: The 256-FPBGA (17×17) package supports high pin density in a small footprint, helping reduce overall PCB area.
• Wide Supply Range: 2.3 V to 3.6 V operation accommodates common system voltage rails and provides flexibility in mixed-voltage environments.
• Industrial Temperature Rating: Specified for −40 °C to 105 °C operation to meet extended temperature requirements in industrial applications.
• Regulatory Compliance: RoHS compliance supports deployment in regions requiring lead-free components.

Why Choose LFX125EB-04F256I?

The LFX125EB-04F256I is positioned for designers seeking a mid-density FPGA from the ispXPGA family that combines moderate logic capacity, built-in RAM, and a high I/O count in a compact industrial-grade BGA package. Its voltage and temperature specifications make it suitable for embedded systems that require reliable operation across extended temperature ranges.

Choose this device when your design needs an integrated, RoHS-compliant FPGA solution with 1,936 logic elements, ample I/O, and packaging that supports production surface-mount assembly. The combination of on-chip memory and gate-equivalent density supports a variety of control, glue-logic and interface functions within a single device.

Request a quote or submit an inquiry to obtain pricing and availability for the LFX125EB-04F256I for your next design or production run.