LFX125EB-03F256C

The LFX125EB-03F256C is an ispXPGA family FPGA from Lattice Semiconductor. It provides a mid-range programmable logic device combining 1,936 logic elements, 94,208 bits of on-chip RAM and up to 160 user I/O pins in a 256-ball BGA package.

Designed for commercial-grade embedded systems, this device targets designs that need flexible logic integration and moderate on-chip memory while operating from a 2.3 V to 3.6 V supply and within a 0 °C to 85 °C temperature range.

Key Features

• Core Logic Contains 1,936 logic elements for implementing custom digital functions and control logic.
• Embedded Memory Provides 94,208 total RAM bits for data buffering, FIFOs, and small on-chip storage needs.
• I/O Capacity Up to 160 user I/O pins enable support for multiple interfaces and signal domains from a single device.
• Gate Count Approximately 139,000 gates to characterize device complexity and integration capability.
• Package and Mounting 256-ball FPBGA (17 × 17) package, surface-mount construction for compact board integration.
• Power Supply Operates from 2.3 V to 3.6 V, supporting common embedded system voltage rails.
• Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• I/O-rich embedded systems — Suited for designs that require up to 160 configurable I/Os to consolidate interfaces and perform protocol bridging.
• Control and glue logic — Use the device’s 1,936 logic elements to implement custom control state machines and board-level glue logic.
• On-chip buffering and small FIFOs — The 94,208 bits of embedded RAM support local data buffering, small FIFO queues, and temporary storage.

Unique Advantages

• Balanced integration density: 1,936 logic elements and ~139,000 gates provide a practical balance of logic capacity for mid-range designs without excessive board-level complexity.
• Substantial embedded memory: 94,208 bits of on-chip RAM reduce external memory needs for buffering and small data structures.
• High I/O count in a compact package: 160 I/Os in a 256-BGA (17 × 17) package enable significant signal integration while conserving PCB area.
• Flexible supply range: 2.3 V to 3.6 V operation simplifies interfacing with common digital voltage rails.
• Commercial-grade readiness: Specified 0 °C to 85 °C operating range and RoHS compliance support mainstream embedded product deployments.
• Part of the ispXPGA family: Listed as an ispXPGA family device, providing predictable positioning within Lattice’s FPGA portfolio.

Why Choose LFX125EB-03F256C?

The LFX125EB-03F256C offers a practical combination of logic capacity, embedded memory, and I/O density in a compact 256-BGA package for commercial embedded designs. Its 2.3 V to 3.6 V supply range and 0 °C to 85 °C rating make it suitable for a wide range of mainstream applications that require flexible programmable logic without large external RAM.

As an ispXPGA family device from Lattice Semiconductor, it provides a clear option for engineers seeking a stable, orderable FPGA with defined specifications for logic elements, RAM bits, I/O count, and package form factor.

If you would like pricing, availability, or a formal quote for LFX125EB-03F256C, please request a quote or submit an inquiry and our team will respond with the next steps.